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Test Structure for Breaking Strength of Thin Film Materials

A technology for testing structures and thin-film materials, applied in the direction of applying stable tension/pressure to test the strength of materials, etc., can solve the problems that it is difficult to realize direct loading of test signals and electrical detection, etc., to achieve stable test process and test parameter values, and calculation methods Simple, low-equipment-required effect

Inactive Publication Date: 2017-02-22
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

For insulating materials, such as silicon nitride, silicon dioxide, and single crystal silicon or polycrystalline silicon wrapped by silicon dioxide, it is not easy to directly load and detect test signals due to their insulating properties.

Method used

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  • Test Structure for Breaking Strength of Thin Film Materials

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Experimental program
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Embodiment Construction

[0019] Attached below figure 1 The present invention will be further described.

[0020] The invention provides a test structure for measuring the breaking strength of thin film materials. The test structure consists of three parts: a thermal expansion drive unit 101; a micrometer vernier 103 with a damping structure; and a tensile beam unit 102 made of the film material to be tested. Wherein, the main body material of the thermal expansion driving unit 101 and the micrometer vernier 103 with a damping structure is polysilicon.

[0021] The thermal expansion driving unit 101 is a gate-shaped structure, including two anchor areas, namely the first anchor area 101-1, the second anchor area 101-2, two horizontal long beams, namely the first horizontal long beam 101-3, the second horizontal long beam Two horizontal long beams 101-4, one vertical wide beam 101-5. The right ends of the two horizontal long beams are respectively vertically connected to the upper and lower ends of ...

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Abstract

The invention discloses a structure for testing the breaking strength of a film material, and the structure can be used for testing the breaking strength of a conductive film material and an insulating film material. According to the structure disclosed by the invention, a force loading and driving part and a breaking strength testing structure which is made from a to-be-tested film material are layered and are laminated and connected by a combination area. The tensile elongation is measured by a vernier structure. For preventing the condition that the actual tensile elongation cannot be measured when the testing structure is snapped, a buffering beam and a damping spring arranged in parallel are adopted for preventing overshoot. The testing structure, a measurement method and a parameter extraction method disclosed by the invention are quite simple and can be used for testing the breaking strength of various film materials such as conductors / insulators.

Description

technical field [0001] The invention provides a test structure for the breaking strength of film materials. The invention belongs to the technical field of microelectromechanical system (MEMS) material parameter testing. Background technique [0002] The performance of MEMS is closely related to the material parameters. Due to the influence of the processing process, some material parameters will change. These uncertain factors caused by the processing technology will make device design and performance prediction uncertain and unstable. The purpose of material parameter testing is to be able to measure the material parameters of MEMS devices manufactured by a specific process in real time, monitor the stability of the process, and feed back the parameters to the designer so that the design can be corrected. Therefore, testing without leaving the processing environment and using general-purpose equipment has become a necessary means of process monitoring. The physical para...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/08
Inventor 李伟华王雷张璐周再发
Owner SOUTHEAST UNIV
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