Micro-channel heat exchanger for drop-shaped pin fins

A micro-channel heat exchanger, drop-shaped technology, applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of high heat flux heat dissipation, etc., to increase the heat transfer area, enhance the heat transfer effect, heat dissipation powerful effect

Inactive Publication Date: 2015-04-29
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention is based on commonly used multi-parallel micro-channel heat exchangers, adding droplet-shaped turbulence elements to each single channel to improve the hea

Method used

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  • Micro-channel heat exchanger for drop-shaped pin fins
  • Micro-channel heat exchanger for drop-shaped pin fins
  • Micro-channel heat exchanger for drop-shaped pin fins

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Embodiment Construction

[0014] The working process and effect of the inventive droplet-shaped turbulent element microchannel heat exchanger will be further described and verified below in conjunction with the structural drawings.

[0015] figure 1 It is a schematic diagram of the three-dimensional general outline of the drop-shaped turbulent element microchannel heat exchanger. The drop-shaped turbulence element micro-channel heat exchanger mainly includes channel cooling medium inlet 1, cooling medium outlet 2, glass cover plate 3, channel inlet end 4, channel outlet end 5, cooling silicon-based channel 6, water drop-shaped turbulence Stream element 7 constitutes. In order to verify that the invention has a better heat transfer effect than conventional channels, Table 1 lists the thermal resistance R, Nusselt number Nu, and heat transfer coefficient h of the heat exchanger for a given Reynolds number Re to characterize heat transfer. The parameters of the effect, and compared with the regular smoo...

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Abstract

The invention discloses a micro-channel heat exchanger for drop-shaped pin fins. A cooling working medium inlet of a channel is connected with the inlet end of the channel; the outlet end of the channel is connected with a cooling working medium outlet; a cooling silicon substrate channel is formed between the inlet end and the outlet end of the channel; the drop-shaped pin fins are placed inside the cooling silicon substrate channel; a glass cover plate is adhered to the top end of the structure for heat insulation. The cooling silicon substrate channel is etched into a micro channel for the drop-shaped pin fins. According to the micro-channel heat exchanger, without adding an additional drive or control device, the aim of enhancing heat exchange can be achieved by increasing a heat exchange area through the simple drop-shaped pin fin structure and enhancing the mixing of cold fluid and hot fluid.

Description

technical field [0001] The invention is used in the heat dissipation field of high-integration and high-power microelectronic components. Reasonable droplet-shaped turbulence elements are added to the channel of the micro-channel heat exchanger. Compared with the smooth channel heat exchanger, the heat exchanger has a higher Nusselt number. Nu means that the heat transfer performance is improved, which provides the possibility for effective heat dissipation of microelectronic components with high integration and high thermal power. Background technique [0002] With the rapid development of microelectromechanical systems (MEMS) and the rapid development of microelectronic components in the direction of small size, light weight and high integration, the heat dissipation problem is directly related to the reliability and stability of the system, and it is necessary to effectively integrate them The high heat flux generated during operation can be taken away, and the reliabilit...

Claims

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Application Information

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IPC IPC(8): H01L23/46
Inventor 刘赵淼张龙祥
Owner BEIJING UNIV OF TECH
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