Molding compound loading device with capability of alarming

Abstract

The invention discloses a molding compound loading device with the capability of alarming. The molding compound loading device comprises a carrying box (1), wherein an emptying hole (2) is formed in the upper end of the carrying box (1), a discharge hole (3) is formed in the lower end of the carrying box (1), the two side walls of the lower end of the carrying box (1) are fixedly connected with guide rails (4) respectively, a cushion plate (6) is arranged between the two guide rails (4), an insertion plate (8) is arranged on the cushion plate (6), a material detector (10) is mounted on the inner side wall of the discharge hole (3), stops (11) are arranged on the two side walls of the upper end of the carrying box (1) respectively, a cylinder (12) is arranged above one stop (11) and is controlled by a processor, a piston rod of the cylinder (12) blocks the stop (11), and the processor is connected with the material detector (10) by virtue of a wireless signal and is electrically connected with a display and a buzzer. The molding compound loading device has the beneficial effects that the molding compound loading device has the advantages of simpleness in operation, high processing quality of products and high processing efficiency of products.

Description

technical field [0001] The invention relates to a loading device, in particular to a molding compound loading device capable of alarming. Background technique [0002] Epoxy molding compound (EMC-Epoxy Molding Compound) is epoxy resin molding compound and epoxy molding compound. Powder molding compound made of various additives. More than 97% of plastic packaging (referred to as plastic packaging) materials use EMC. The plastic packaging process uses transfer molding to extrude EMC into the mold cavity, embeds the semiconductor chip in it, and cross-links and solidifies it at the same time to become a product with a certain structural appearance. Semiconductor device. [0003] The molding compound loading device used in the existing molding compound processing equipment has a constant amount of molding compound and cannot be adjusted, so that the processing efficiency of the molding compound cannot be changed. Moreover, during the processing of the existing molding compoun...

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Problems solved by technology

[0003] The molding compound loading device used in the existing molding compound processing equipment has a constant amount of molding compound and cannot be adjusted, so that the processing efficiency of the molding compound cannot be changed. Moreover, during the processing of the existing molding compound, due to the operation The personnel cannot accurately know whether the plastic sealing compound in the loading box has been blanked. Often during the operation of the equipment, the operator will drag the loading box out for inspection, but after the loading box is pulled out, the equipment is in idle operation, resulting in The processing efficiency of the molding compound is reduced, which affects the processing efficiency, and when the carrier box is moving back and forth, the molding compound is easily squeezed and deformed when it is at the discharge port, resulting in a low yield of the processed plastic compound

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