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Process module layout method of gluing developer

A technology of process modules and layout methods, applied in the directions of comprehensive factory control, comprehensive factory control, digital control, etc., can solve the problems of complex operation, large floor space, inconvenient maintenance, etc., to achieve convenient operation, small floor space, Maintenance-friendly effect

Inactive Publication Date: 2015-05-06
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structural design and layout of the process modules in the existing machine are multi-style, but they all have many shortcomings such as large floor area, inconvenient maintenance, and complicated operation.

Method used

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  • Process module layout method of gluing developer
  • Process module layout method of gluing developer

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings.

[0017] Such as Figure 1-2 As shown, the gluing and developing machine in the present invention includes a cassette station 1, a process station 2 and an interface station 3 connected in sequence, wherein the process station 2 is provided with a gluing module 4, a developing module 5, a heat treatment module 6 and a process station The robot 9, the gluing module 4 and the developing module 5 are all arranged in front of the process station 2, and the developing module 5 is located above the gluing module 4, the gluing module 4 and the developing module 5 are concentrated to form a process rotation processing center, for Wafers are glued and developed. Heat treatment modules 6 are provided on both sides and the back of the process station 2 , and the process station robot 9 is set at the center of the process station 2 . The wafer transfer between the cassette station...

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Abstract

The invention relates to the technical field of a process treatment module in a gluing developer in semiconductor production, and particularly relates to a process module layout method of a gluing developer. The gluing developer comprises a film magazine station, a process station, and an interface station, which are sequentially connected in series. The process station is internally provided with gluing modules, developing modules, thermal treatment modules, and a process station robot, wherein the gluing modules and the developing modules are arranged in the front of the process station, the developing modules are disposed above the gluing modules, the two sides and the back of the process station are respectively provided with one thermal treatment module, the process station robot is arranged in the center position of the process station, and the process station robot transfers wafers to the film magazine station and the interface station through the thermal treatment modules at the two sides. The process module layout method of the invention meets the requirement of process production and high capacity, and has the advantages of small occupation area, convenient maintenance, easy operation, low operation cost, and large process expanding window.

Description

technical field [0001] The invention relates to the technical field of process modules in a glue-coating developing machine in semiconductor production, in particular to a process module layout method of a glue-coating developing machine. Background technique [0002] In semiconductor production, the main production equipment is a photolithography machine and a glue developing machine, which are produced in an in-line operation. The requirements of large-scale integrated circuit production lines for glue-coating and developing machines are to meet the requirements of process production and high production capacity, small footprint, convenient maintenance, convenient operation, low operating costs, and large process expansion window. [0003] At present, on the large-scale integrated circuit production line, the adhesive developing machine that works in-line with the lithography machine is usually composed of a cassette station, a process station and an interface station, etc...

Claims

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Application Information

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IPC IPC(8): G05B19/418
CPCY02P90/02G05B19/18
Inventor 王阳魏猛郑春海胡延兵
Owner SHENYANG KINGSEMI CO LTD
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