Etching and cleaning device and method for OSP substrate

An etching equipment and etching technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of inability to control the composition of chemical etching agents at any time, the inability to change the composition conveniently, and the low etching efficiency. Save packaging equipment and materials, excellent corrosion inhibition performance, good etching effect

Active Publication Date: 2015-05-06
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the etching efficiency is not high, the uniformity is not good, and the composition of the etching agent cannot be changed conveniently, and the composition of the chemical etching agent cannot be controlled at any time according to different etching requirements.

Method used

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  • Etching and cleaning device and method for OSP substrate
  • Etching and cleaning device and method for OSP substrate
  • Etching and cleaning device and method for OSP substrate

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] A specific embodiment of the present invention provides a method for etching and cleaning an OSP substrate before ball planting,

[0034] A kind of etching cleaning method of OSP substrate comprises:

[0035] Such as figure 2 As shown, the first step: the chemicals are mixed in proportion and added to the cavity of the etching cleaning equipment;

[0036] The chemical agent, each component is calculated by weight percentage, and each component is H202 2-10%, H2SO4 4-20%, AGS2116 1-5%, AGS2115 10-50%, and the rest is pure water.

[0037]The ad...

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PUM

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Abstract

The invention discloses an etching and cleaning method for OSP substrate. The etching and cleaning method for OSP substrate comprises the following steps: step 1, mixing the H2SO4 solvent, H2O2 solvent, additive AGS2116, additive AGS2115 and pure water, adding the chemical agent prepared according to the ratio into the cavity of the etching and cleaning device; step 2, guiding the OSP substrate to the etching and spraying chamber and the cleaning and spraying chamber through the track of the etching and cleaning device; step 3, etching the OSP substrate in the etching and spraying chamber, cleaning the OSP substrate in the cleaning and spraying chamber; step 4, checking the etching effect, confirming whether the OSP layer and the oxide layer are etched from the bonding pad. An etching and cleaning device for OSP substrate is also provided, the etching effect of the chemical agent is good, and the etching effect is more even. The H2SO4, H2O2 and other chemical agent are separated via the etching device and prepared according to the scene production status and practical situation of the OSP substrate, and the etching value is controlled, the operation is convenient and the efficiency is high.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a solution-etched OSP substrate etching and cleaning device before ball planting and a method for etching and cleaning before ball planting. Background technique [0002] OSP is an organic solderability preservative (abbreviation for Organic Solderanility Preservative). OSP is to grow a layer of organic film chemically on the clean bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. , to protect the copper surface from rusting (oxidation or vulcanization, etc.) in a normal environment; due to low cost and high solderability, it is now more and more used in OSP substrate packaging. However, before soldering, because the pads on the OSP substrate go through multiple processes, the OSP is damaged by force, the copper layer is oxidized by heat, etc., the industry often cleans the OSP, and then reflows the solder balls. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/311
CPCH01L21/31058H01L21/31111H01L21/31133H01L21/67023H01L21/6708
Inventor 张伟贺晓建
Owner NANTONG FUJITSU MICROELECTRONICS
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