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Deposited thin film film thickness distribution measurement system

A measurement system and film thickness technology, applied in measurement devices, instruments, etc., can solve the problems of time-consuming equipment, expensive, complicated, etc., and achieve the effect of saving manpower and material resources, simplifying test plans, and saving money

Active Publication Date: 2018-03-06
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing measurement method is to deposit the whole sample in the cavity or place a small substrate at the main detection point and take it out to measure the thickness with film thickness testing equipment such as a step meter and ellipsometer. The process is quite complicated and consumes a lot of time. and the equipment used is quite expensive
In addition, testing in this way is not only time-consuming and costly, but also obtains less information. Only one thickness distribution can be obtained in one experiment.

Method used

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  • Deposited thin film film thickness distribution measurement system
  • Deposited thin film film thickness distribution measurement system
  • Deposited thin film film thickness distribution measurement system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] see figure 1 , a deposited film thickness distribution measuring system, comprising a first film thickness testing unit 10, a vacuum chamber 6, a film thickness measuring instrument 4 and a computer 5; combining several first film thickness testing units 10 into a one-dimensional or multi-dimensional array, Fix on a plane or space support, connect several first film thickness test units 10 in parallel to form a first network 11, place it in the vacuum chamber 6, and the first network 11 is connected to the film thickness measuring instrument 4 through wires , the film thickness measuring instrument 4 is connected to a computer 5 . The first film thickness testing unit 10 includes a quartz crystal oscillator 1, an electronic switch 2 and a crystal oscillator circuit 3, the quartz crystal oscillator 1 is connected to the crystal oscillator circuit 3, and the crystal oscillator circuit 3 is connected to the first network 11 through the electronic switch 2 .

[0018] The ...

Embodiment 2

[0020] see figure 2 , this embodiment is basically the same as Embodiment 1, the difference is that the first film thickness test unit 10 is replaced by a second film thickness test unit 12, and several second film thickness test units 12 are combined into a one-dimensional or multi-dimensional array , fixed on a plane or space support, several second film thickness test units 12 are connected in parallel to form a second network 13, placed in the vacuum cavity 6, and the second network 13 is placed in the vacuum cavity through wire connection 6, the crystal oscillator circuit 3 is connected to the film thickness measuring instrument 4 and the computer 5 in sequence, and the second film thickness test unit 12 includes a quartz crystal oscillator plate 1 and an electronic switch 2, and the quartz crystal oscillator plate 1 passes through the electronic switch 2 is connected to the second network 13.

Embodiment 3

[0022] see image 3 , a film thickness distribution measurement system for deposited thin films measured outside vacuum. Before entering the vacuum cavity 6, the second network 13 is first connected to the crystal oscillator circuit 3 and the film thickness measuring instrument 4; the electronic switch 2 in each second film thickness test unit 12 is controlled by the computer 5, so that the electronic switch 2 is opened successively , and at the same time interval, only one electronic switch 2 is opened and connected to the second network 13, and connected to the crystal oscillator circuit 3 to obtain the oscillation frequency of the corresponding film thickness measured by the film thickness measuring instrument 4 to obtain the thickness of the deposited film at the corresponding position before evaporation The information is transmitted to the computer 5 until all test units are tested. Then the second network 13 is placed in the vacuum cavity 6 without being connected to t...

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PUM

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Abstract

The invention relates to a deposition film thickness distribution measuring system. The deposition film thickness distribution measuring system comprises first film thickness testing units, a vacuum cavity, a film thickness measuring instrument and a computer; a first film thickness testing units are combined into a one-dimensional or multi-dimensional array and fixed on a planar or spatial support; the plurality of first film thickness testing units are connected in parallel into a first network and placed into the vacuum cavity; the first network is connected with the film thickness measuring instrument by use of a lead; the film thickness measuring instrument is connected with the computer. The deposition film thickness distribution measuring system is capable of measuring three types of data, namely thickness, average velocity and instantaneous velocity. The deposition film thickness distribution measuring system is capable of measuring the distribution diagram of the deposition speeds and the thicknesses of various time periods in the whole deposition process, and is highly beneficial for analyzing the whole deposition process.

Description

technical field [0001] The invention relates to a system for measuring the thickness distribution of deposited thin films. Background technique [0002] Physical vapor deposition and chemical vapor deposition technologies are widely used in the development and production of flat panel displays, optics, microelectronics, sensors and various devices. The growth rate and thickness as well as its uniformity during film deposition are very important parameters. Especially in production, its uniformity has a great influence on the yield of products, so it is an important indicator in the debugging, testing and acceptance of some large instruments. However, the existing measurement method is to deposit the whole sample in the cavity or place a small substrate at the main detection point and take it out to measure the thickness with film thickness testing equipment such as a step meter and ellipsometer. The process is quite complicated and consumes a lot of time. and the equipment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/08
CPCG01B21/08
Inventor 张建华张志林蒋雪茵
Owner SHANGHAI UNIV