Multilayer ceramic electronic component and board having the same mounted thereon

A technology of multilayer ceramics and electronic components, which is applied in the direction of electrical components, laminated capacitors, fixed capacitor electrodes, etc., can solve problems such as discomfort for listeners, and achieve the effect of reducing acoustic noise

Active Publication Date: 2015-05-20
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Vibrating sounds can correspond to tonal frequencies ranging from 20 Hz to 20,000 Hz, causing discomfort to the listener

Method used

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  • Multilayer ceramic electronic component and board having the same mounted thereon
  • Multilayer ceramic electronic component and board having the same mounted thereon
  • Multilayer ceramic electronic component and board having the same mounted thereon

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Embodiment Construction

[0034] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0035] This disclosure, however, may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0036] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0037] The directions of the hexahedron will be defined to clearly describe the exemplary embodiments of the present disclosure. T, L, and W shown in the drawings refer to a thickness direction, a length direction, and a width direction, respectively. The direction along which the dielectric layers are stacked may be referred to...

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Abstract

A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions of a mounting surface of the ceramic body, and first and second internal electrodes alternately stacked, having the dielectric layer therebetween, exposed through at least one side surface of the ceramic body, and connected to the first and second external electrodes, respectively; and an interposer substrate including an insulation substrate bonded to the mounting surface of the multilayer ceramic capacitor, and first and second connection terminals formed on the insulation substrate and connected to the first and second external electrodes, respectively.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0138632 filed in the Korean Intellectual Property Office on November 14, 2013, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer ceramic electronic component and a board on which the multilayer ceramic electronic component is mounted. Background technique [0003] Multilayer ceramic capacitors (multilayer chip electronic components) are mounted in several devices such as display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs), etc.), computers, personal digital assistants (PDAs), and mobile phones. A chip capacitor on a circuit board of an electronic product for charging into or discharging from it. [0004] Multilayer ceramic capacitors (MLCCs) may be used as components of various electronic devices due to advantages such as small size, high capacity, and ease of mounting. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/002H01G2/02
CPCH01G2/06H01G4/232H01G4/30H05K1/141H05K1/144H05K1/181H05K2201/049H05K2201/10015H05K2201/10378H01G4/005H01G4/01H01G4/228H01G4/236
Inventor 朴祥秀朴珉哲
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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