Filter manufacturing method adopting gold-wire bonding wire

Abstract

The invention discloses a filter manufacturing method adopting a gold-wire bonding wire and relates to the technical field of a filter. The method uses the gold-wire bonding wire for replacing an inductance in a micro-strip form to form the filter together with other components in the filter; the gold-wire bonding wire is bonded on a corresponding pressure point of the filter by automatic bonding equipment. The gold-wire bonding wire is used for replacing the conventional micro-strip line inductance, and thus, the parasitic effect on the ground is smaller, in-pass-band insertion loss of the filter is lower and out-of-band rejection capacity is stronger; compared with a conventional chip filter, the filter has a more compact structure and is smaller in chip size.

Description

technical field [0001] The invention relates to the technical field of filters, in particular to a filter manufacturing method capable of obtaining lower insertion loss and having high out-of-band suppression characteristics. Background technique [0002] As microwave and millimeter wave technologies are widely used in guidance, radar, short-range communication and other fields, higher and higher requirements are put forward for the frequency mixing and filtering modules in transceivers. These requirements include not only miniaturization and low cost, but also higher performance and consistency. Chip technology has become the pillar of today's microwave technology development, and the design of frequency mixing and filtering modules using chips will better meet the above requirements. At present, the frequency mixing and filtering module uses multiple discrete chips, mainly because the high-performance filter circuit is difficult to integrate with other chip circuits, and ...

AI Technical Summary

Problems solved by technology

Although this method greatly reduces the size and cost of the module by using chip circuits, it does not achieve the best performance and consistency.

This is because the chip circuit will reduce the consistency during the cascading process, and will cause impedance mismatch, resulting in unnecessary energy loss of the signal

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