Manufacturing packaging method of electrochromic anti-dazzle device for vehicle

Abstract

The invention relates to a packaging method of an electrochromic anti-dazzle device, and in particular relates to a packaging manufacturing method for edging and chamfering in a conduction region, where an electrode needs to be imported, of the conductive layer of the glass substrate of the electrochromic anti-dazzle device so as to increase the sectional area of a conductive silver adhesive; according to the requirements of reduce the package and the electrode leading-out region of the electrochromic anti-dazzle device and increasing the thermochromic device structure of a visible range, the packaging of the electrochromic anti-dazzle device is completed by use of the techniques of etching, vacuum electrochromic material pouring, sealant box hot pressing, silver adhesive pouring, heat treatment and the like. Compared with the traditional packaging of the electrochromic anti-dazzle device, the electrical conductivity of the silver adhesive after heat treatment is improved, the width of the conductive sealant is reduced and the production process and the equipment are simplified; the packaging method has obvious advantages; the height of the visual range of the electrochromic anti-dazzle device package is increased by 2-3mm.

Description

technical field [0001] The invention relates to the technical field of anti-glare mirrors for automobiles, in particular to a packaging method for manufacturing a vehicle electrochromic anti-glare device used for eliminating the influence of glare and ensuring driving safety when cars meet at night. Background technique [0002] Using the characteristics of electrochromic functional materials to apply anti-glare technology in the automotive field is an effective method to improve driving safety. The structure of the electrochromic anti-glare device is mostly a sandwich-type multi-layer structure, for example: "glass | ITO (transparent conductive layer) | EC (electrochromic layer) | IC (ion conductive layer) | IS (ion storage layer) layer) | ITO (transparent conductive layer) | glass" five-layer structure, "glass | ITO (transparent conductive layer) | EC (composite electrochromic layer) | Wait. There is a gap of 0.05-0.2mm between the two glass substrates with conductive la...

AI Technical Summary

Problems solved by technology

The difficulty of this packaging method is that the construction technology of the two kinds of glue is very difficult. Two kinds of glue are dispensed at one time, and it is easy to produce mutual extrusion and penetration when laminating. Due to the presence of air, the sealing glue lines are squeezed and deformed, so The bonding and packaging can only be completed under vacuum conditions, which requires quite high equipment

At the same time, because the conductive silver glue is bound by the upper and lower glass substrates, the silver powder cannot be deposited well in the glue and cured into a good conductive material, and its conductivity is greatly affected. Therefore, the width of the conductive glue needs to be more than 1.5mm. In order to meet the conductivity requirements

In order to solve the problem of interpenetration, it is necessary to pre-cure the inner layer adhesive first, and then apply the conductive silver adhesive, which increases the difficulty of the construction process. Improper pre-curing control may still lead to poor packaging problems.

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