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4results about How to "Increase opening width" patented technology

Pre-trepanning type external wall insulation structure

ActiveCN222332997UAffect the bonding stabilityGuaranteed bonding stabilityHeat proofingStructural engineeringMechanical engineering
The utility model relates to the technical field of building heat preservation, and discloses a pre-trepanning type outer wall heat preservation structure which comprises a heat preservation plate and a connecting piece arranged at the end of the heat preservation plate, the connecting piece comprises a body arranged on an outer wall and a fixing piece, and the body is provided with a containing cavity for containing an expansion pipe and a clamping opening communicated with the containing cavity and provided with an opening deviating from the outer wall. The fixing piece is provided with a clamping part matched with the clamping opening in a clamping mode, and the fixing piece extends towards the side, away from the outer wall, of the heat preservation plate so as to apply extrusion force towards the outer wall to the heat preservation plate, so that the situation that the bonding effect of the heat preservation plate and the outer wall is affected due to the fact that powder generated by trepanning enters the space between the heat preservation plate and the outer wall is avoided. Therefore, the bonding stability of the heat preservation plate and the outer wall is guaranteed, meanwhile, the situation that the bonding effect of the heat preservation plate and the outer wall is affected due to vibration of the heat preservation plate caused by trepanning of the heat preservation plate is avoided, meanwhile, compared with heat preservation nails, the connecting area of the fixing pieces and the heat preservation plate is increased, and the stability of the heat preservation plate is further improved.
Owner:WEIHAI GOLDEN ELEPHANT IND CO LTD

Powder packaging bag boxing, shaping and stacking system

The invention relates to the technical field of bagged powder conveying, in particular to a powder packaging bag boxing, shaping and stacking system. The packaging bag stacking device comprises a bag grabbing conveyor used for conveying trays, the bag grabbing conveyor is arranged on the side of a packaging bag conveyor used for conveying powder packaging bags, a stacking mechanical arm is arranged between the packaging bag conveyor and the bag grabbing conveyor, a box clamp used for grabbing the packaging bags is installed on the stacking mechanical arm, and a stacking supporting frame is arranged in the middle of the bag grabbing conveyor. A movable box body structure is mounted on the stacking support frame; the movable box body structure is designed, and limiting can be assisted in the stacking process; when the stacking height is high, the number of the movable box body structures can be increased, synchronous control is achieved, and the application range is wide; the lengthened box body clamp is used, on one hand, the stroke of the clamp can be increased, so that the stacking requirement is met, and on the other hand, the opening width of the clamp during clamping is increased, so that the clamp is suitable for packaging bags with different widths.
Owner:CHANGZHOU TIANSHENG ZIJIN AUTOMATION EQUIP CO LTD

Method for forming interlayer dielectric layer

The invention provides a method for forming an interlayer dielectric layer, which comprises the following steps of: providing a substrate which comprises a first region and a second region, and the density of a gate structure of the first region is greater than that of a gate structure of the second region; forming a first dielectric layer to conformally cover the surface of the substrate and the surface of the stop layer on the outer wall of the gate structure, wherein the first dielectric layer between the gate structures in the first region is provided with a first gap with an opening; forming a first side wall structure to cover the first dielectric layer at a partial height of the side wall of the gate structure, exposing the first dielectric layer at the top of the gate structure, and at least partially merging the first side wall structures in the first gap; etching the exposed first dielectric layer to remove a part of thickness of the first dielectric layer; and removing the first side wall structure, forming a second dielectric layer, conformally covering the first dielectric layer and filling the second dielectric layer above the gate structure, and taking the second dielectric layer and the first dielectric layer as interlayer dielectric layers. The filling effect and the filling efficiency of the dielectric layer between the gate structures can be improved.
Owner:CHONGQING XINLIAN MICROELECTRONICS CO LTD

Method for manufacturing moisture-permeable waterproof shoes

ActiveCN116982781BIncrease opening widthprevent prolapseUpperBootlegsInterior space
A method for making a detachable and easy-to-wear waterproof and moisture-permeable shoe includes: sewing a welt strip along an opening flange of a shoe upper panel to the shoe upper panel; sewing a tongue piece along the opening flange to the shoe upper panel and the welt strip, the tongue piece having a loop portion and a tongue portion, the tongue piece having greater elasticity than the shoe upper panel; sewing two back end abutment flanges of the shoe upper panel together, and sewing two side end flanges of the loop portion together; turning the shoe upper panel and the tongue piece inside out; sewing a top connecting end portion of a shoe-like inner sleeve defining a wearing space to the loop portion; turning the shoe upper panel and the tongue piece outside in with respect to the shoe-like inner sleeve; sewing a bottom portion of the shoe upper panel closed, the shoe upper panel and the tongue piece cooperating to define an interior space; inserting a shoe last into the wearing space; and securing a shoe sole to the bottom portion of the shoe upper panel.
Owner:张中豪 +1