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Medium board and manufacturing method thereof

一种制作方法、中介的技术，应用在中介板及其制作领域，能够解决制作方法复杂等问题，达到避免热应力生成的效果

Inactive Publication Date: 2015-05-27
QI DING TECHNOLOGY QINHUANGDAO CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the above manufacturing method needs to spray a seed layer into the receiving through hole, and then electroplate the conductive element in the receiving through hole, the manufacturing method is relatively complicated.

Method used

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  • Medium board and manufacturing method thereof
  • Medium board and manufacturing method thereof
  • Medium board and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0020] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0021] see figure 1 , the interposer 10 provided by the embodiment of the present invention includes an insulating substrate 11 , a photosensitive dielectric layer 12 , a metal conductive layer 13 and a conductive element 14 .

[0022] The insulating substrate 11 includes a first surface 10a and a second surface 10b away from the first surface 10a. The insulating substrate 11 can be made of thermosetting resins such as phenolic resin, epoxy resin, polyimide, etc., or thermoplastic resins such as polyethylene, polypropylene, polyvinyl chloride, or glass or ceramics. . In this embodiment, the insulating substrate 11 is made of glass. The insulating substrate 11 defines a receiving through hole 110 penetrating through the first surface 10 a and the second surface 10 b simultaneously.

[0023] The photosensitive medium layer 12 is formed on...

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PUM

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Abstract

An interposer includes an insulating substrate, a photosensitive dielectric film, a conductive layer, and a conductive via. The insulating substrate includes a bottom surface and a top surface, and defines a receiving through hole extending through the bottom surface and the top surface. The photosensitive dielectric film is mounted on the bottom surface. The photosensitive dielectric film defines a through hole spatially corresponding to and communicating with the receiving through hole. The conductive layer is mounted on an end of the photosensitive dielectric film away from the insulating substrate. The conductive layer covers an end of the through hole. The conductive via is received in the receiving through hole and the through hole. The conductive via contacts and electrically connects to the conductive layer.

Description

technical field [0001] The invention relates to a packaging technology, in particular to an interposer and a manufacturing method thereof. Background technique [0002] At present, the manufacturing method of the interposer is as follows: firstly, a receiving through hole is formed on an insulating substrate, and the insulating substrate includes a first surface and a second surface away from the first surface, and the receiving through hole penetrates through the first surface. A surface and the second surface; both the first surface and the second surface in the receiving through hole are sprayed with a seed layer; then the seed layer is electroplated on the first surface and the second surface in the receiving through hole to form a first metal conductive layer ; remove the first metal conductive layer on the first surface and the second surface; form a dielectric layer on the second surface, and open a through hole on the dielectric layer corresponding to the receiving t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/538H01L23/498H01L21/48
CPCH05K3/423H05K1/0306H05K3/007H05K3/421H05K3/427Y10T29/49165
Inventor 李泰求
Owner QI DING TECHNOLOGY QINHUANGDAO CO LTD
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