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Printed circuit board and manufacturing method thereof

A technology for printed circuit boards and daughter boards, which is used in the manufacture of multi-layer circuits, printed circuit components, and the formation of electrical connections of printed components. question

Active Publication Date: 2015-05-27
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, pre-opened prepreg combined with copper foil is used to protect the crimped blind hole of the sub-board against infiltration. The prepreg has certain fluidity at high temperature. Therefore, the fluid material constituting the prepreg can easily enter the blind hole. , corrodes the hole wall and affects the electrical performance of the entire printed circuit board

Method used

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  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof

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Embodiment Construction

[0067] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0068] See Figure 1 to Figure 7 , The embodiment of the present invention provides a method for manufacturing a printed circuit board, including the following steps:

[0069] Step S101, such as figure 2 As shown, at least one first through hole 805a is provided on the first sub-board 80a, and the first sub-board 80a is provided with a back drilling surface 801a and a crimping surface 803a disposed opposite to each other. The first throug...

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Abstract

The invention provides a printed circuit board. The printed circuit board comprises multiple daughter boards, wherein the daughter boards comprise a first daughter board located on the outermost side of the printed circuit board; at least one first through hole is formed in the first daughter board and penetrates through back drilling surface and a compression joint surface of the first daughter board; the wall of the first through hole is plated with a conductive metal layer; a first step hole is formed in the first daughter board in a back drilling manner and is communicated with the first through hole; the projection of the first step hole on the back drilling surface of the first daughter board covers the projection of the first through hole on the back drilling surface of the first daughter board; the first step hole is separated from other holes formed in the first daughter board. The invention further provides a manufacturing method of the printed circuit board. According to the printed circuit board and the method, the step hole is formed, so that accommodation space for accommodating a fluid is formed, and the fluid can be prevented from flowing into a blind hole of the printed circuit board.

Description

Technical field [0001] The present invention relates to the field of electronic devices, in particular to a printed circuit board and a manufacturing method of the printed circuit board. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the integration of integrated circuit boards. Ordinary single-sided crimping cannot meet the demand for system capacity. The double-sided crimping blind hole design is adopted, that is, two daughter boards are superimposed to form a mother board. The board structure can be crimped on both sides to expand the backplane capacity. In addition, the demand for high-speed performance makes the density of crimping connectors smaller and smaller, and the pitch of the crimping blind holes on the corresponding printed circuit boards is getting smaller and smaller. [0003] When crimping the daughter board to form the mother board or processing the mother board through holes, it is nec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/42H05K3/46
Inventor 蔡黎刘山当李志海高峰
Owner HUAWEI TECH CO LTD
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