Printed circuit board blind slot processing method
A printed circuit board and printed circuit technology, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of blind slot printed circuit board performance and signal transmission instability, and achieve the effect of improving the signal
Active Publication Date: 2015-05-27
SHENZHEN WUZHU TECH
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Problems solved by technology
[0007] The present invention mainly solves the technical problem of unstable performance and signal transmission of the blind slot printed circuit board processed by the existing printed circuit board blind slot processing method
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] The invention discloses a method for processing blind grooves of printed circuit boards, please refer to figure 1 and Figure 2, figure 1 It is a flow chart of the steps of the method for processing blind grooves of printed circuit boards provided by the present invention, Figure 2a-2c Yes figure 1 Schematic diagram of the planar structure of the blind slot processing process of the printed circuit board shown. The method for processing a blind groove of a printed circuit board comprises the following steps...
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The invention provides a printed circuit board blind slot processing method. The printed circuit board blind slot processing method comprises the following steps: providing a first substrate; punching a first blind slot on the surface of a bottom circuit layer; providing an insulating plate and punching a through hole in the insulating plate; etching the bottom circuit layer of the first substrate and manufacturing to finish a circuit pattern; providing a second substrate, and laminating the first substrate, the insulating plate and the second substrate to form a circuit board; punching a second blind slot, enabling the first blind slot and the second blind slot to be communicated to form the blind slot of the printed circuit board, and finishing manufacturing the printed circuit board. According to the printed circuit board blind slot processing method disclosed by the invention, the printed circuit board blind slot is manufactured by firstly internally punching deep slots, then laminating and butting, and then uncovering at the top; the method solves the technical problems that vacancies are formed at the copper layer on the blind slot side wall edge, the blind slot side wall edge insulating plate and the substrate due to chemical solutions and adhesive removal, and the error of the punched slot is generated by the punching machine, so that the signal and performance the printed circuit board can be improved, and the service life can be prolonged.
Description
technical field [0001] The invention relates to a method for processing a printed circuit board, in particular to a method for processing a blind groove of a printed circuit board. Background technique [0002] Modern electronic products tend to be miniaturized, highly integrated, and high-frequency. Due to the increasing popularity of buried component boards, some products have begun to introduce blind slot designs for installing components or fixing products, improving the overall integration of products or achieving signal integrity. The role of shielding. Blind slots on printed circuit boards generally require soldering of components, and blind slots are used for welding and fixing products. Therefore, there are particularly strict requirements on the size, depth, and shape of blind slots. Blind slot printed circuit board refers to two substrates pressed together, with different shapes and sizes, and one layer needs to expose the soldering part. [0003] For the proces...
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IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/0047H05K3/4697H05K2201/09036H05K2203/0228
Inventor 曾志李春明梁高
Owner SHENZHEN WUZHU TECH