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MEMS device and preparation method thereof for preventing structure layer from falling off

A technology of structural layers and devices, which is applied in the direction of microstructure technology, electric solid devices, semiconductor devices, etc., can solve the problems of structural layer shedding, etc., and achieve the effect of reducing stress and preventing shedding

Active Publication Date: 2016-08-17
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned existing problems, the present invention discloses a MEMS device and a preparation method thereof to prevent structural layers from falling off, so as to overcome the problem in the prior art that the structural layers sometimes fall off from the MEMS device due to excessive stress of silicon germanium

Method used

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  • MEMS device and preparation method thereof for preventing structure layer from falling off
  • MEMS device and preparation method thereof for preventing structure layer from falling off
  • MEMS device and preparation method thereof for preventing structure layer from falling off

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Embodiment 1

[0037] Figure 4 It is a schematic structural view of the MEMS device that prevents the structure layer from coming off in the present invention; as Figure 4 Shown:

[0038] This embodiment provides a kind of MEMS device that prevents the structural layer from coming off, and this MEMS device comprises a substrate structure with a dielectric layer 3', and a metal layer 4' (such as a Ge layer) on the dielectric layer 3' upper surface of the substrate structure. ), and the oxide layer 5' (such as SiO 2 ) layer, the above-mentioned substrate structure, metal layer 4' and oxide layer 5' form a microelectromechanical structure, four grooves 6 are located in the depletion region of the microelectromechanical structure, and a structure layer 7 covers the four grooves 6 The bottom and side walls of the structure layer and the upper surface of the oxide layer 5', and an opening 8 is also provided in the structural layer 7, and the opening 8 penetrates from the upper surface of the s...

Embodiment 2

[0044] Figure 1~4 It is a schematic flow diagram of the method for preparing a MEMS device that prevents structural layers from coming off in the present invention;

[0045] This embodiment relates to a method for preparing a MEMS device that prevents structural layers from falling off, comprising the following steps:

[0046] Step 1, providing a substrate structure with a dielectric layer 3, wherein the substrate structure includes a substrate 1, a pad 2 and a dielectric layer 3, the dielectric layer 3 covers the upper surface of the pad 2, and part of the pad 2 Embedded in the inside of the dielectric layer 3, the dielectric layer 3 is also provided with an interconnection line (not shown in the figure) connecting the pad 2 and the upper structure of the dielectric layer. The material of the interconnection line is silicon germanium. Silicon germanium has good electrical properties, and the selection of this material can improve device performance, such as figure 1 struct...

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Abstract

The invention relates to an MEMS device for preventing a structural layer from peeling and a manufacturing method of the MEMS device. A groove is formed in an empty area of an MEMS structure by sequentially etching an oxide layer and a metal layer into a dielectric layer, a silicon germanium material layer is deposited above the remaining oxide layer and the groove as the structural layer, and a part of the silicon germanium material layer is deposited in the groove, so that a part of stress of the silicon germanium material layer is released, and the silicon germanium material positioned below the oxide layer offsets a part of stress of the silicon germanium material positioned above the oxide layer, thereby effectively reducing the stress of the structural layer (the silicon germanium material layer), and then preventing the phenomenon that the structural layer peels from the MEMS device.

Description

technical field [0001] The invention relates to the technical field of micro-electromechanical manufacturing, in particular to a MEMS device and a preparation method thereof for preventing structural layers from falling off. Background technique [0002] In recent years, with the development of micro-electro-mechanical technology, micro-electro-mechanical systems (MEMS for short) devices manufactured by micro-electro-mechanical technology have become popular due to their small size, light weight, low power consumption, good durability, and low price. How to further improve the performance of MEMS devices has always been the direction of research in the field of MEMS. [0003] At present, because silicon germanium material has good electrical properties, silicon germanium material is usually used as the structural layer of MEMS devices. However, due to the excessive stress of silicon germanium, sometimes the structural layer material will fall off from the MEMS device. [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B81B7/00
Inventor 王伟郑超郭亮良
Owner SEMICON MFG INT (SHANGHAI) CORP