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A kind of led lamp

A technology for LED lamps and LED lighting, which is applied to cooling/heating devices, lighting and heating equipment, electrical components and other directions of lighting devices, can solve the problem of low photoelectric conversion efficiency of LEDs, and achieve good heat dissipation effect, reliability and life. Effect

Active Publication Date: 2018-04-24
SHENZHEN CIDLY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For the use of LED lighting fixtures, it is necessary to integrate a large number of LED components on a module to achieve the required illuminance. However, the photoelectric conversion efficiency of LEDs is not high, and most of the electrical energy is eventually converted into heat energy.

Method used

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  • A kind of led lamp
  • A kind of led lamp
  • A kind of led lamp

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Embodiment Construction

[0025] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0026] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed", "connected", "set", "installed" on another feature, it can be directly fixed, connected, set or installed on another feature A feature can also be indirectly fixed and connected to another feature. In addition, descriptions such as up, down, left, and right used in the present invention are only relative to the mutual positional relationship of the components of the present invention in the drawings. Moreover, "a" or "one" in the present inv...

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Abstract

An LED illuminating device (100) comprises: a base (10), made of a metal radiating material; a mirror surface aluminum plate (50), laminated on and attached to the base (10) in a cold pressing manner, wherein at least one area of the surface of the mirror surface aluminum plate (50) is a die bonding area; multiple naked LED chips (40), directly bonded to a die bonding area of the mirror surface aluminum plate (50) by binder; a circuit board (30), mounted on the base (10), wherein the LED chips (40) and the circuit board (30) form electrical connections in a wire bonding manner; and a packaging gel (20), at least forming potting coverage to the die bonding area. Also disclosed is an LED illuminating lamp (200) using the LED illuminating device (100). According to the LED illuminating device (100) and the LED lamp (200), the transmission path of heat emitted from an LED is greatly reduced compared with that of a surface-mount packaging structure and that of a COB packaging structure, the radiating effect is good, and the reliability and the service life of the LED are greatly improved.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED lamp. Background technique [0002] For the use of LED lighting fixtures, it is necessary to integrate a large number of LED components on a module to achieve the required illuminance. However, the photoelectric conversion efficiency of LEDs is not high, and most of the electrical energy is eventually converted into heat energy. Heat has become one of the biggest threats to LEDs, which not only affects the electrical properties of LEDs, but may eventually lead to LED failure (when the temperature of LEDs rises, the luminous intensity of LEDs will decrease, the main wavelength of light will shift, the life will be severely reduced, and the light will be accelerated. decline). Therefore, how to keep LEDs working continuously and reliably for a long time is the biggest technical problem in LED packaging or application at present. Contents of the invention [0003] Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S8/00F21V19/00F21V29/503F21Y115/10
CPCF21V17/10F21V19/002F21V23/00F21V23/06F21S8/00F21V19/00F21V29/00H01L2224/48091H01L2224/48247H01L2224/73265H01L33/00H01L33/60H01L2924/00014
Inventor 杨亚西
Owner SHENZHEN CIDLY