Low power consumption fingerprint lock device
A fingerprint lock, low power consumption technology, applied in the direction of electric solid state devices, semiconductor devices, semiconductor/solid state device components, etc., can solve the problem of reducing the height of the module, improve product reliability, enhance data processing speed and power Stable performance, effect of reducing thickness
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Embodiment 1
[0024] Embodiment 1: A low-power fingerprint lock device, including a fingerprint identification chip 1, a number of blind holes 2 are distributed on the upper surface of the fingerprint identification chip 1, and aluminum pads 3 are arranged in the blind holes 2 of the fingerprint identification chip 1 , the aluminum pad 3 extends from the bottom of the blind hole 2 to the middle of the blind hole 2, and the surface of the aluminum pad 3 in the blind hole 2 is covered with a nickel metal layer 4 and a gold-palladium alloy layer 15 in turn. The middle part extends to the upper surface of the fingerprint identification chip 1 and forms a protrusion to form a pad thickening part 5, and the gold-palladium alloy layer 15 is located on the surface of the pad thickening part 5;
[0025] The lower surface of the fingerprint identification chip 1 and the area opposite to the blind hole 2 have a first tapered blind hole 6 and a second tapered blind hole 7 from outside to inside, and the...
Embodiment 2
[0028] Embodiment 2: A low-power fingerprint lock device, including a fingerprint identification chip 1, a number of blind holes 2 are distributed on the upper surface of the fingerprint identification chip 1, and aluminum pads are arranged in the blind holes 2 of the fingerprint identification chip 1 3. The aluminum pad 3 extends from the bottom of the blind hole 2 to the middle of the blind hole 2, and the surface of the aluminum pad 3 in the blind hole 2 is covered with a nickel metal layer 4 and a gold-palladium alloy layer 15 in sequence. 2. The middle part extends to the upper surface of the fingerprint identification chip 1 and forms a protrusion to form a pad thickening part 5, and the gold-palladium alloy layer 15 is located on the surface of the pad thickening part 5;
[0029] The lower surface of the fingerprint identification chip 1 and the area opposite to the blind hole 2 have a first tapered blind hole 6 and a second tapered blind hole 7 from outside to inside, a...
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