Fingerprint lock identification module package structure

Abstract

The invention discloses a fingerprint lock recognition module packaging structure. The fingerprint lock recognition module packaging structure comprises a fingerprint recognition chip, a ceramic cover plate, a PCB and a data processing chip, wherein the PCB and the data processing chip are electrically connected with the fingerprint recognition chip; a first tapered blind hole and a second tapered blind hole are sequentially formed in areas, back on to blind holes, of the lower surface of the fingerprint recognition chip from outside to inside; the second tapered blind hole is formed in the bottom of the first tapered blind hole; sections of the first tapered blind hole and the second tapered blind hole are tapered; the bottom of the second tapered blind hole is an aluminum bonding pad of the fingerprint recognition chip; the surfaces of aluminum welding pads in the blind holes are sequentially covered with nickel metal layers and gold palladium alloy layers; the nickel metal layers extend from the middles of the blind holes to the upper surface of the fingerprint recognition chip and form bulges so as to form bonding pad thickening parts; the gold palladium alloy layers are positioned on the surfaces of the bonding pad thickening parts. After wafer-level chip packaging technology and a silicon through hole technology are integrated, a set of novel process is formed, so that the reliability of the product is greatly improved, the thickness is reduced and the total thickness of a product is greatly reduced.

Description

technical field [0001] The invention relates to a packaging structure of a fingerprint identification module, which belongs to the technical field of semiconductor packaging. Background technique [0002] In terms of advanced packaging technology for fingerprint chips, after the release of Apple's iPhone 5S and its matching TouchID fingerprint recognition technology, it announced a brand new fingerprint recognition chip. It uses wafer-level packaging technology to dig grooves on the side of each chip and redo the pads, and then uses the well-known low loop height (low loop height) wire bonding technology to complete the module packaging to reduce the number of modules. High, is a transitional technology that mixes wafer-level packaging and traditional packaging. The Touch ID packaging structure announced by Apple’s patent text is realized by wire bonding, but only grooves are dug on the surface of the chip to reduce the height of the module after wire bonding. We have not ...

AI Technical Summary

Problems solved by technology

The Touch ID packaging structure announced by Apple’s patent text is realized by wire bonding, but only grooves are dug on the surface of the chip to reduce the height of the module after wire bonding. I have not seen the packaging form and patent of the fingerprint identification chip that really adopts the wafer-level TSV packaging technology

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