The invention discloses a packaging technology for a novel
fingerprint lock device. The novel
fingerprint lock device comprises a
fingerprint recognition
chip, a
ceramic cover plate, a flexible PCB and a
data processing chip. The packaging technology comprises the following steps: filling the surfaces of aluminum
welding pads in blind holes of the
fingerprint recognition chip with
nickel metal layers to extend out of the upper surface and form bulges so as to form bonding pad thickening parts;
coating the upper surface, having the bonding pad thickening parts, of the
fingerprint recognition chip with a temporary bonding
adhesive layer; bonding a glass supporting plate with the surface, having the bonding pad thickening parts, of the
fingerprint recognition chip through the temporary bonding
adhesive layer;
thinning the lower surface opposite to the upper surface of the fingerprint recognition chip so as to reduce the thickness of the fingerprint recognition chip to about 150-300 microns; sequentially forming a first tapered
blind hole, a second tapered
blind hole and third tapered blind holes in the lower surface of the fingerprint recognition chip by
etching gradually. After
wafer-level chip packaging technology and a
silicon through hole technology are integrated, a set of novel process is formed, so that the thickness is reduced, the
total thickness of a product is greatly reduced and the reliability of the product is greatly improved.