Packaging technology for novel fingerprint lock device

Abstract

The invention discloses a packaging technology for a novel fingerprint lock device. The novel fingerprint lock device comprises a fingerprint recognition chip, a ceramic cover plate, a flexible PCB and a data processing chip. The packaging technology comprises the following steps: filling the surfaces of aluminum welding pads in blind holes of the fingerprint recognition chip with nickel metal layers to extend out of the upper surface and form bulges so as to form bonding pad thickening parts; coating the upper surface, having the bonding pad thickening parts, of the fingerprint recognition chip with a temporary bonding adhesive layer; bonding a glass supporting plate with the surface, having the bonding pad thickening parts, of the fingerprint recognition chip through the temporary bonding adhesive layer; thinning the lower surface opposite to the upper surface of the fingerprint recognition chip so as to reduce the thickness of the fingerprint recognition chip to about 150-300 microns; sequentially forming a first tapered blind hole, a second tapered blind hole and third tapered blind holes in the lower surface of the fingerprint recognition chip by etching gradually. After wafer-level chip packaging technology and a silicon through hole technology are integrated, a set of novel process is formed, so that the thickness is reduced, the total thickness of a product is greatly reduced and the reliability of the product is greatly improved.

Description

technical field [0001] The invention relates to a packaging process for a novel fingerprint lock device, which belongs to the technical field of semiconductor packaging. Background technique [0002] In terms of advanced packaging technology for fingerprint chips, after the release of Apple's iPhone 5S and its matching Touch ID fingerprint recognition technology, it announced a brand new fingerprint recognition chip. , which uses the wafer-level packaging technology to dig grooves on the side of each chip and redo the pads, and then uses the well-known low loop height (low loop height) wire bonding technology to complete the module packaging in the later stage to reduce the mold Group height is a transitional technology that mixes wafer-level packaging and traditional packaging. The Touch ID packaging structure announced by Apple’s patent text is realized by wire bonding, but only grooves are dug on the surface of the chip to reduce the height of the module after wire bondi...

AI Technical Summary

Problems solved by technology

The Touch ID packaging structure announced by Apple’s patent text is realized by wire bonding, but only grooves are dug on the surface of the chip to reduce the height of the module after wire bonding. Therefore, in the packaging technology of advanced fingerprint chips, there are still no I have not seen the packaging form and patent of the fingerprint identification chip that really adopts the wafer-level TSV packaging technology

Images