Epoxy molding compound for infrared receiving head and preparation method thereof

Abstract

The invention relates to an epoxy plastic sealing compound for an infrared receiving head and a preparation method thereof. The invention belongs to the technical field of epoxy molding compound. The epoxy molding compound for the infrared receiving head contains components and their mass percentages are bisphenol A epoxy resin 0.1%-80%, triglycidyl isocyanurate 0.1%-60%, curing agent 10%-60%, Polyoxyethylene alkyl ether 0.1%-2% and silicone mold release agent 0.1%-2%. The preparation process of epoxy molding compound: (1) fully melt and mix bisphenol A epoxy resin, triglycidyl isocyanurate and infrared colorant at 80-120°C for 5-60min; (2) mix silicone Release agent, polyoxyethylene alkyl ether, and curing agent are added to the mixture in step (1), keep at 80-120°C and fully melt and mix for 5-30 minutes; (3) cool down to 60-80°C, add curing accelerator, and mix for 1 ‑10min; cooling, crushing and pre-pressing. The epoxy molding compound of the present invention can completely block visible light below 840nm, has a very high infrared transmittance at 930nm, and has the advantages of excellent mold release, solder resistance and reliability during packaging.

Description

Technical field [0001] The invention belongs to the technical field of epoxy plastic sealing materials, and particularly relates to an epoxy plastic sealing material for infrared receiving heads and a preparation method thereof. Background technique [0002] At present, the production methods of infrared receivers mainly include glue filling and molding. The glue filling method is a more traditional way, which has the characteristics of low investment and low price. However, due to its poor anti-light interference ability, the acceptance angle is small. Therefore, it is increasingly unable to meet the needs of the market. Therefore, molded infrared receivers are gradually being widely used. They are produced by molded methods and have the advantages of beautiful appearance, strong anti-light interference ability, large acceptance angle, and high reliability. However, there are also some shortcomings. The most common problem is that due to the use of mold encapsulation, mold stick...

AI Technical Summary

Problems solved by technology

[0003] For this reason, in the production of infrared receiving heads, the main method at present is to spray liquid release agent outside. Although it can effectively solve the problem of mold release, it needs to be sprayed once every 3-5 molds, which brings a lot of problems. A series of problems, such as increased processes, increased costs, possible oil spots on the appearance, frequent mold cleaning, etc.

On the other hand, many attempts have been made in epoxy molding compounds. Although the addition of traditional epoxy molding compound internal release agents, such as carnauba wax, montan wax, polyethylene wax, etc., can significantly improve the epoxy The release property of the plastic encapsulant, but there are technical problems such as the infrared light transmission of the product after the addition is seriously affected

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