Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Epoxy molding compound for infrared receiving head and preparation method thereof

A technology of epoxy molding compound and receiving head, which is applied in the field of epoxy molding compound, which can solve the problems of infrared light transmission, cost increase, and oil spots on the appearance of products, so as to reduce the number of times of use, improve mold release, and reduce oil spot effect

Active Publication Date: 2017-09-01
天津凯华绝缘材料股份有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For this reason, in the production of infrared receiving heads, the main method at present is to spray liquid release agent outside. Although it can effectively solve the problem of mold release, it needs to be sprayed once every 3-5 molds, which brings a lot of problems. A series of problems, such as increased processes, increased costs, possible oil spots on the appearance, frequent mold cleaning, etc.
On the other hand, many attempts have been made in epoxy molding compounds. Although the addition of traditional epoxy molding compound internal release agents, such as carnauba wax, montan wax, polyethylene wax, etc., can significantly improve the epoxy The release property of the plastic encapsulant, but there are technical problems such as the infrared light transmission of the product after the addition is seriously affected

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy molding compound for infrared receiving head and preparation method thereof
  • Epoxy molding compound for infrared receiving head and preparation method thereof
  • Epoxy molding compound for infrared receiving head and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Epoxy plastic encapsulant for infrared receiver and its preparation: weigh the components according to the proportions in Table 1, and fully melt and mix bisphenol A epoxy resin, TGIC and infrared colorant at 80°C for 40 minutes, and then add silicone to remove Molding agent, polyoxyethylene alkyl ether, curing agent, keep at 80℃ and fully melt and mix for 40min. Cool down to 60°C, add curing accelerator, and mix for 5 minutes. The melt-mixed mixture is cooled to room temperature, crushed and pre-compressed, and the performance is tested.

Embodiment 2

[0031] Epoxy molding compound for infrared receiver and its preparation: weigh the components according to the proportions in Table 1, and fully melt and mix bisphenol A epoxy resin, TGIC and infrared colorant at 100°C for 20 minutes, and then add silicone to remove Molding agent, polyoxyethylene alkyl ether, curing agent, keep 100℃ and fully melt and mix for 20min. Cool down to 70°C, add curing accelerator, and mix for 5 minutes. The melt-mixed mixture is cooled to room temperature, crushed and pre-compressed, and the performance is tested.

Embodiment 3

[0033] Epoxy plastic encapsulant for infrared receiver and its preparation: weigh the components according to the proportions in Table 1, and fully melt and mix bisphenol A epoxy resin, TGIC and infrared colorant at 120°C for 5 minutes, and then add silicone to remove Molding agent, polyoxyethylene alkyl ether, curing agent, keep 120°C and fully melt and mix for 5 minutes. Cool down to 80°C, add curing accelerator, and mix for 3 minutes. The melted and mixed mixture is cooled to room temperature, crushed and pre-compressed, and the performance is tested.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to an epoxy plastic sealing compound for an infrared receiving head and a preparation method thereof. The invention belongs to the technical field of epoxy molding compound. The epoxy molding compound for the infrared receiving head contains components and their mass percentages are bisphenol A epoxy resin 0.1%-80%, triglycidyl isocyanurate 0.1%-60%, curing agent 10%-60%, Polyoxyethylene alkyl ether 0.1%-2% and silicone mold release agent 0.1%-2%. The preparation process of epoxy molding compound: (1) fully melt and mix bisphenol A epoxy resin, triglycidyl isocyanurate and infrared colorant at 80-120°C for 5-60min; (2) mix silicone Release agent, polyoxyethylene alkyl ether, and curing agent are added to the mixture in step (1), keep at 80-120°C and fully melt and mix for 5-30 minutes; (3) cool down to 60-80°C, add curing accelerator, and mix for 1 ‑10min; cooling, crushing and pre-pressing. The epoxy molding compound of the present invention can completely block visible light below 840nm, has a very high infrared transmittance at 930nm, and has the advantages of excellent mold release, solder resistance and reliability during packaging.

Description

Technical field [0001] The invention belongs to the technical field of epoxy plastic sealing materials, and particularly relates to an epoxy plastic sealing material for infrared receiving heads and a preparation method thereof. Background technique [0002] At present, the production methods of infrared receivers mainly include glue filling and molding. The glue filling method is a more traditional way, which has the characteristics of low investment and low price. However, due to its poor anti-light interference ability, the acceptance angle is small. Therefore, it is increasingly unable to meet the needs of the market. Therefore, molded infrared receivers are gradually being widely used. They are produced by molded methods and have the advantages of beautiful appearance, strong anti-light interference ability, large acceptance angle, and high reliability. However, there are also some shortcomings. The most common problem is that due to the use of mold encapsulation, mold stick...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L83/04C08K5/3492C08G59/42
Inventor 罗春晖赵生领席小悦任志军
Owner 天津凯华绝缘材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com