Gas distributing plate
A technology of gas distribution plate and plasma, which is applied in the field of plasma technology, can solve the problems of etching, reducing the service life of gas distribution plate, affecting the uniformity and stability of plasma distribution, etc., so as to improve production yield and use The effect of life and stability guarantee
Inactive Publication Date: 2015-06-10
ADVANCED MICRO FAB EQUIP INC CHINA
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Problems solved by technology
[0003] However, since the material of the gas distribution plate is generally metal, alloy, ceramic or other materials, in the plasma atmosphere, the surface of the gas distribution plate is unstable and is easily etched by the plasma, thus reducing the service life of the gas distribution plate
At the same time, changes in the geometric dimensions and surface chemical composition of the gas distribution plate caused by plasma etching will affect the uniformity and stability of the plasma distribution, which will lead to the stability of the plasma etching process and affect the semiconductor Chip quality and production yield
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[0029] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0030] As described in the background art, the existing general gas distribution plate is easily etched by the plasma during the plasma process, which affects the stability of the plasma process, and thereby reduces the production yield of the chip.
[0031] In order to solve the above technical problems, the present invention provides ...
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Abstract
The invention provides a gas distributing plate comprising a substrate and a plasma etching resistant coating covering the surface of the substrate. Materials of the plasma etching resistant coating are highly stable and unreactive to plasma used in the plasma process. Therefore, during plasma processing process or the plasma etching process, the gas distributing plate has high surface stability and is never corroded by the plasma, no new material forms on the surface of the gas distributing plate, surface stability of the gas distributing plate is guaranteed, and the service life of the gas distributing plate is prolonged. Further, the gas distributing plate with stable surface has the advantages that stability of the plasma process is guaranteed and chip yield is further increased.
Description
Technical field [0001] The invention relates to the field of plasma technology, in particular to a gas distribution plate. Background technique [0002] As we all know, the gas distribution plate (GDP) or shower head (SH) is an important component in the plasma processing technology or plasma etching system. For example, in a plasma etching reaction chamber with a capacitively coupled plasma (CCP) plasma source, the function of the gas distribution plate is not only to realize the gas transport and distribution, but also can usually be used as the upper electrode to generate Or and sustain plasma etching of wafers or chips. [0003] However, since the material of the gas distribution plate is generally metal, alloy, ceramic or other materials, the surface of the gas distribution plate is unstable in a plasma atmosphere and is easily etched by the plasma, thereby reducing the service life of the gas distribution plate. At the same time, changes in the geometric size and surface ch...
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Login to View More IPC IPC(8): H01J37/32
CPCH01J37/3244H01J37/3255H01J37/32559H01J2237/33H01J2237/334
Inventor 贺小明姚国峰
Owner ADVANCED MICRO FAB EQUIP INC CHINA