Heat sink planting method and device

Abstract

The invention relates to a method and device for planting and placing heat sinks, comprising: a machine platform on which a first rail and second and third rail frames located on both sides of the first rail are arranged; the first rail is provided with a second A rail frame, the first, second, and second rail frames are provided with flow channels for carrying substrates on the tray; a pressing device is placed on the sliding path of the first rail, which is adjacent to and arranged on the second rail. A rail frame is provided with a die on the other side of the operator; a pick-and-place mechanism is located on the side of the first rail frame; the heat sink is placed on the The carrier plate on the support mold is placed on the base plate, and the moving-in flow path of the carrier plate and the moving-out flow path form an intersection at the place where the heat sink is pressed, so as to improve production efficiency.

Description

technical field [0001] The invention relates to a planting method and device, in particular to a heat sink planting method and device for planting a heat sink on a substrate for placing chips. Background technique [0002] In the general semiconductor packaging process, for semiconductors that need to be packaged with heat sinks, the viscous material is usually injected on the lead frame or substrate where the chip has been placed, and then the heat sink is placed on the viscous material, and then the heat sink is placed on the viscous material. The pressing operation fixes the heat sink and the viscous material for a period of time, and then the whole is moved into a baking device for drying. [0003] The traditional heat sink implantation process uses one machine to simultaneously inject viscous material and implant heat sinks on the lead frame or substrate on which the chip has been placed, but due to the limited space of the machine, it is limited to one by one. The tra...

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Problems solved by technology

[0003] The traditional above-mentioned heat sink implantation process uses one machine to simultaneously inject viscous material and implant heat sinks on the lead frame or substrate on which the chip has been placed. However, due to the limited space of the machine, it is limited to one by one. The transported lead frame or substrate is packaged with heat sink, which obviously cannot improve the production efficiency! Therefore, it is the current heat sink packaging trend to separate the injection of viscous material and the implantation of the heat sink into different machines, and cooperate with the transfer mechanism between them to form a heat sink packaging trend; a lead frame that places most of the chips Or the substrates are arranged in a matrix in a tray, and then the tray is transported to a machine for injecting viscous material, and then the tray is moved to another machine for implanting heat sinks. use

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