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Method for producing resinous multilayer substrate

A technology of multilayer substrate and manufacturing method, which is applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of no via hole filling manufacturing method, no masking carrier film, etc., and achieve the suppression of short circuit defects , Suppress the effect of splashing and suppressing undulations

Active Publication Date: 2015-06-17
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in Patent Document 2, there is no description of a manufacturing method for via filling, and there is no carrier film that functions as a mask for via filling.

Method used

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  • Method for producing resinous multilayer substrate
  • Method for producing resinous multilayer substrate
  • Method for producing resinous multilayer substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0038] refer to figure 1 with figure 2 An example of the present invention will be described.

[0039] (pasting process)

[0040] First, if figure 1 As shown in (a), the conductor layer 2 is formed on one surface of the insulating substrate (insulating sheet) 1, and the carrier film 3 is attached so that peeling is possible on the other surface. Preferably, the carrier film has some holding power and is slightly adhesive when stretched without undue force.

[0041] The insulating substrate 1 contains thermoplastic resin. Examples of thermoplastic resins include polyimide, liquid crystal polymer (LCP), polyetherketone resin (PEEK), and polyphenylene sulfide resin (PPS). When the insulating substrate contains a thermoplastic resin, since the resin tends to flow by heat treatment, it is preferable that the heat treatment such as stamping (batch thermocompression bonding) after lamination be relatively low temperature.

[0042] As the material of the conductor layer 2, for ...

Embodiment approach 2

[0074] In this embodiment, the shape (cavity portion) of a part (unnecessary portion 10) of the insulating substrate cut out by the slit includes at least one corner portion ( Image 6 (b)). Image 6 (b), from Image 6 The shape shown in (a) has an R with the corners removed. This embodiment differs from Embodiment 1 in this point, and is the same as Embodiment 1 in other respects. In addition, the shape here means the shape seen from the normal direction of the principal surface of an insulating substrate.

[0075] In addition, the insulating substrate 11 including the unnecessary portion 10 of such a shape is, for example, Figure 7 As shown, a plurality of substrate base materials 100 can be used for simultaneous production.

[0076] At least one part of the corner (corner part) of the cutting part (unnecessary part 10) is provided with R (the shape of the circumferential part having a predetermined curvature radius R), so that insulation can be prevented during transpo...

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PUM

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Abstract

A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.

Description

technical field [0001] The present invention relates to a method for manufacturing a resin multilayer substrate. Background technique [0002] A resin multilayer substrate having a rigid portion and a flexible portion is known. This kind of resin multilayer substrate is composed of a flexible part (a relatively high flexibility part with a small thickness or number of layers) and a rigid part (a relatively low flexibility part with a large thickness or number of layers). The number of insulating substrates is different or the constituent materials are different. As a method of manufacturing a resin multilayer board, there is known a method in which resin sheets made of thermoplastic resin on which conductive patterns are formed are laminated, and the laminates are bonded together by heating and pressing with a hot press plate. . [0003] Patent Document 1 (Japanese Patent Laid-Open No. 2003-264369) discloses the following method of manufacturing a single-sided conductor p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4632H05K3/005H05K3/4053H05K3/4691H05K2203/0191H05K2203/0228Y10T29/49124Y10T29/49126Y10T29/49162Y10T29/49165
Inventor 小坪拓也千坂俊介
Owner MURATA MFG CO LTD
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