A kind of diamond micro-drilling abrasive tool

Abstract

A diamond micro-drilling abrasive tool, including a base body and a grinding layer. The grinding layer is a diamond particle layer and is plated on the surface of the base body through electroplating. Its thickness is 0.04mm~0.08mm. The top of the base body is set as a grinding head. The grinding head is The top end face is a flat surface, and a cross-shaped groove is provided on the top end face of the grinding head and the shape of the groove is semicircular. A center hole is provided in the axial center of the grinding head to eliminate the low-speed grinding zone; the gap between the grinding head and the base body is A stepped base is provided in between, which includes a primary enlarging step and a secondary enlarging step. The primary enlarging step is located on the grinding head side, and the secondary enlarging step is located on the base body side. The invention is mainly used for micro-hole drilling and grinding of hard and brittle materials. It can achieve vertical cutting in the cutting method. Compared with the traditional spiral cutting method, it is easier to set the tool and the processing program is simpler, effectively shortening the processing cycle. The invention effectively improves the clogging of the micro grinding head and the wear of the grinding layer, improves the quality and size consistency of the micropores, and prolongs the service life of the grinding tool.

Description

technical field [0001] The invention belongs to the technical field of micro-drill grinding, in particular to a diamond micro-drill grinding tool. Background technique [0002] At this stage, the mechanical precision machining of fine features on hard and brittle materials has been widely used in manufacturing, such as the processing of micro holes and micro grooves on the glass cover of mobile phones. However, it is very difficult to machine micro-pores on the surface of such hard and brittle materials, and the cost of tools occupied by the machining process is usually high. [0003] At present, the grinding tools commonly used in the processing of micro-holes (hole diameter less than 1mm) are diamond micro-drilling abrasives. Due to the limitation of the structure, only the spiral cutting method can be used to process the micro holes, but this processing method is also accompanied by many shortcomings, including long processing cycle, difficult tool setting, complicated p...

AI Technical Summary

Problems solved by technology

However, it is very difficult to machine micro-pores on the surface of such hard and brittle materials, and the cost of tools occupied by the machining process is usually high

[0003] At present, the grinding tools commonly used in the processing of micro-holes (hole diameter less than 1mm) are diamond micro-drilling abrasives. Due to the limitation of the structure, only the spiral cutting method can be used to process the micro holes, but this processing method is also accompanied by many shortcomings, including long processing cycle, difficult tool setting, complicated programming, and because the line of the grinding head rotation center The speed is 0, resulting in extremely fast loss of the center of the grinding head, which directly shortens the service life of the grinding tool

Images