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Plastics moulding composition and use thereof

A technique for molding compositions and mixtures, applied in thin material handling, electrical equipment casings/cabinets/drawers, transportation and packaging, etc.

Active Publication Date: 2015-06-24
EMS PATENT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Integrating electronic and mechanical functions in injection molding can lead to miniaturization of integrated devices

Method used

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  • Plastics moulding composition and use thereof
  • Plastics moulding composition and use thereof
  • Plastics moulding composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment B1 to B17 and comparative example VB1

[0206] Embodiment B1 to B17 and comparative example VB1 to VB6

[0207] The components in Tables 2 and 3 were compounded with the predetermined processing parameters (see Table 1) in a twin-screw extruder from Werner und Pfleiderer with a screw diameter of 25 mm. The polyamide pellets and additives are metered into the feed zone, while the glass fibers are metered into the polymer melt via side feeder 3 (cylinder unit before the die). The compound exits a 3 mm diameter nozzle in the form of an extrudate and is pelletized after water cooling. The granules were dried at 110° C. for 24 hours under a reduced pressure of 30 mbar. The above compounded formulations were injection molded using an Arburg Allrounder 320-210-750 machine to give test specimens with zones 1 to 4 having a predetermined barrel temperature and having a predetermined molding temperature (see Table 1).

[0208] Table 1: Compounding and Injection Molding Conditions for Inventive and Comparative Examples

[02...

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Abstract

A description is given of thermoplastic, white-pigmented plastics moulding compositions having improved mechanical properties, especially for LDS applications. The thermoplastic moulding composition consists of: (A) 20-88 wt % of a mixture consisting of (A1) 60-100 wt % of a thermoplastic (A2) 0-40 wt % of a mixture of (A2_1) 0-40 wt % of a thermoplastic other than (A1); (A2_2) 0-40 wt % of impact modifiers other than (A1) and (A2_1); (B) 10-70 wt % of fibrous adjuvants; (C) 0.1-10 wt % of an LDS additive or of a mixture of LDS additives, at least one LDS additive being selected from the following group: metal oxide based on copper, neodymium, molybdenum, bismuth, antimony or tin, with the proviso that spinels are excluded; metal phosphate; metal hydroxide phosphate; (D) 0.1-20 wt % of white pigment; (E) 0-20 wt % of particulate filler other than C and / or D; (F) 0-2 wt % of further, different additives; a the sum of (A)-(F) making up 100 wt %.

Description

technical field [0001] The present invention relates to thermoplastic molding compositions having improved mechanical properties. In addition to glass fibers, the molding composition contains white pigments and LDS additives. The molded articles thus obtained can be metallised orientated after localized irradiation. The molding compositions according to the invention are useful in particular in the production of injection molded circuit carriers. Background technique [0002] Molded Interconnect Devices (MIDs) - circuit carriers made of thermoplastics - offer the following advantages over existing circuit carriers: increased design freedom, effective environmental compatibility and manufacturing processes with the final product Related rationalization potential. Integrating electronic and mechanical functions in injection molding can lead to miniaturization of integrated devices. In addition, entirely new functions can be realized and virtually any shape can be designed....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08K13/04C08K7/14C08K3/22C08K3/30
CPCC08L77/02C08L77/06C08L2203/20C08L2205/02C08L2205/03C08L2205/025C08K13/04C08K7/14C08K2003/3036C08K2003/2241C08K3/22C08K3/24C08K3/30C08K3/32C08K7/02C08L77/00Y10T428/1352C08L2205/16H05K5/0247
Inventor 乔治·施特佩尔曼
Owner EMS PATENT AG
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