A full reinforcement method and system for anti-single event flipping of semiconductor circuits

Abstract

The present invention is applicable to the field of semiconductors, and provides a method and system for fully strengthening semiconductor circuits against single event flipping. The method includes: dividing the semiconductor circuit into multiple modules; determining sensitive nodes in each module, and recording the sensitive The simulation data of the node; according to the simulation data of the sensitive node, add a time redundancy structure at all or part of the sensitive node to realize the full reinforcement function; adjust the parameters of the MOS tube to maintain the flipping time of the sensitive node Within the delay bounds of the time redundancy structure; verifying circuit functionality. In the present invention, the circuit is divided into blocks before simulation, and the sensitive nodes in each module are respectively determined, so as to add a time redundant structure to the sensitive nodes, realize the full reinforcement function, and further enhance the reinforcement effect by adjusting the parameters of the MOS tube , to achieve the design standard of full reinforcement, simple operation, small increase in circuit area, and low increase in power consumption.

Description

technical field [0001] The invention belongs to the field of semiconductors, and in particular relates to a full reinforcement method and system for semiconductor circuits against single event flipping. Background technique [0002] A large number of semiconductor chips are integrated in modern aerospace systems. Because the earth and the universe are full of various energetic particles, these high-energy particles penetrate the chip shell and transmit to the sensitive area of ​​the semiconductor circuit. Due to the instantaneous energy transmission of a single particle, the chip The voltage of a certain area or node jumps instantaneously, causing the logic state of the digital circuit to change instantaneously, that is, a single event flip occurs. [0003] With the continuous advancement of semiconductor technology, single event upset has become the main cause of chip failure and errors in aerospace systems. Submicron semiconductor chips below 0.13um process are especially ...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the embodiments of the present invention is to provide a full reinforcement method for anti-single event flipping of semiconductor circuits, aiming to solve the problems of low efficiency and poor reinforcement effect of the current simulation and design methods for full reinforcement anti-single event flipping in semiconductor circuits

Images