Chip electronic component and manufacturing method thereof

Abstract

There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a / b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0158078 filed in the Korean Intellectual Property Office on December 18, 2013, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip electronic component and a manufacturing method thereof. Background technique [0003] Inductors, which are chip electronic components, are representative passive components that constitute electronic circuits together with resistors and capacitors to remove noise. The inductor is combined with a capacitor using electromagnetic properties to constitute a resonance circuit, a filter circuit, etc. that amplify a signal of a specific frequency band. [0004] Recently, since miniaturization and slimming of information technology (IT) devices such as various communication devices, display devices, etc. Research on technologies for thinning and thinning has been continuously carried out. Induct...

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Problems solved by technology

[0009] However, in the case of forming the inner coil by the existing pattern plating method using a plating resist, in order to increase the thickness of the coil pattern, the thickness of the plating resist should be increased, and the plating resist having the increased thickness should Having a predetermined width or more to maintain its shape, causing problems such as increased spacing between coil patterns

[0010] In addition, when the inner coil is formed using the electroplating process according to the related art, since the coil pattern grows isotropically in the width and thickness directions of the coil pattern, a short circuit may occur between the coil patterns, and the relatively high height of the coil may be achieved. There will be limitations in terms of aspect ratio (AR)

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