Ring piece structure and manufacturing method thereof
A manufacturing method and ring technology, applied in the ring structure and its manufacturing field, can solve problems such as product defects, easy to drop, and affect the sputtering environment, and achieve the effect of enhancing the ability to absorb deposits
Inactive Publication Date: 2015-07-01
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology
Peeling will occur after these particles accumulate on the ring structure to a certain extent. The peeled deposits will not only affect the sputtering environment, but also easily fall on the sputtering surface, resulting in product defects or even scrapping
Method used
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[0040] During the process of sputtering deposition, a certain amount of deposits will be left on the joint (knob) of the ring in the sputtering equipment, and these deposits are prone to peeling off when attached to a certain extent. substances will affect the sputtering environment and product quality.
[0041] For this reason, the present invention provides a ring structure to avoid peeling off of deposits on the connecting portion as far as possible. refer to figure 1 as well as figure 2 , is a structural schematic diagram of an embodiment of the ring structure of the present invention, including:
[0042] Ring 100;
[0043] A plurality of cylindrical connecting parts 110 fixed on the ring 100, the side walls of the connecting parts 110 are provided with knurled pattern 112 (refer to figure 2 ).
[0044] In this embodiment, both the ring 100 and the connection part 110 are made of tantalum (Ta), but the present invention does not limit the materials of the ring 100 ...
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Abstract
The invention provides a ring piece structure and a manufacturing method thereof. The ring piece structure comprises a plurality of cylindrical connecting parts fixed on a ring piece, wherein reticulate patterns formed by knurling are arranged on the side walls of the connecting parts. Besides, the invention also provides the manufacturing method of the ring piece structure, and the method comprises the following steps: providing the ring piece; providing the cylindrical connecting parts with the reticulate patterns formed on the side walls; and fixing the plurality of cylindrical connecting parts on the ring piece. The ring piece structure has the beneficial effects that the reticulate patterns are formed on the connecting parts by knurling treatment to increase the roughness of the surfaces of the connecting parts and can retain a certain amount of deposits, namely the capability of absorbing the deposits is increased, and then the probability of scaling on the connecting parts is reduced. Moreover, the deposits retained in the reticulate patterns cannot be influenced by sputtered atoms in a sputtering process easily, so that the scaling of the deposits on the connecting parts is further avoided.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a ring structure and a manufacturing method thereof. Background technique [0002] A sputtering deposition (Sputtering Deposition, SD) process is commonly used in semiconductor manufacturing to sputter metal onto a substrate to form a thin film. This process is a kind of physical vapor deposition (Physical Vapor Deposition, PVD), which bombards the sputtering target with high-energy particles, so that the bombarded target atoms or molecules leave the solid and enter the gas, and precipitate and accumulate in the to-be-deposited A thin film is formed on the surface of the substrate. The high-energy particle process is accomplished through special sputtering equipment. [0003] During the sputtering process, a ring structure is generally arranged in the sputtering device to constrain the trajectory of sputtered particles, that is, the ring structure plays a role in focu...
Claims
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IPC IPC(8): C23C14/34
Inventor 姚力军赵凯相原俊夫大岩一彦潘杰王学泽吴剑波
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD