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Wafer processing system and wafer processing method

A technology of silicon wafer and control system

Inactive Publication Date: 2015-07-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the transition of the vacuum lock chamber between vacuum and atmospheric states is not considered, and this transition takes a long time, the transition of the vacuum lock chamber state takes more time and reduces the efficiency of transmission during silicon wafer processing. It also increases the loss of the instrument and shortens the service life of the instrument

Method used

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  • Wafer processing system and wafer processing method
  • Wafer processing system and wafer processing method
  • Wafer processing system and wafer processing method

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Embodiment Construction

[0051]In order to make the object, technical solution and advantages of the present invention more clear, the specific implementation of the silicon wafer processing system and method according to the embodiment of the present invention will be described below with reference to the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0052] A system for processing silicon wafers according to an embodiment of the present invention, such as figure 1 , figure 2 As shown, it includes: a process chamber 700, a transfer device and a control system 800;

[0053] The silicon wafer processing system transports silicon wafers to the process chamber 700 in the silicon wafer processing engineering.

[0054] The transfer device performs specific silicon wafer transfer tasks, including a wafer bin 100, an atmospheric manipulator 300, a vacuum manipulator 600 and a ...

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PUM

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Abstract

The invention discloses a wafer processing system and a wafer processing method. The system comprises technology cavities, a transmission device and a control system, wherein the control system comprises an initialization module, a state setting module, a loadlock selection module and a transmission module; the initialization module is used for initializing processing components in the processing system; the state setting module is used for setting states of loadlocks the same as a vacrobot or an atmrobot contacted with the loadlocks when the vacrobot or the atmrobot takes or places wafers to the loadlocks; the loadlock selection module is used for selecting the loadlocks according to idle states and vacuum states of the loadlocks when the vacrobot or the atmrobot takes or places the wafers to the loadlocks; and the transmission module is used for setting transmission paths of the wafers between loadports and the technology cavities according to the selected loadlocks and transmitting the wafers according to the set transmission paths. The conversion time of the loadlocks is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a system and method for processing silicon wafers. Background technique [0002] In the current semiconductor equipment manufacturing, the silicon wafer processing system includes a process chamber for processing silicon wafers, as well as a loadport for storing silicon wafers, and the silicon wafers in each process task (job) The wafers are placed in the cassette first, and then the cassette is placed in the cassette; the control system needs to transfer the wafers from the cassette to the transfer chamber during the process of processing the wafers according to the process tasks Indoor, and then transferred to the process chamber for process processing, that is, the silicon wafer is transferred to the process chamber through the silicon wafer transfer platform for process processing. [0003] Existing silicon wafer transfer platforms, generally, such as figure 1 As sho...

Claims

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Application Information

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IPC IPC(8): H01J37/18H01L21/67
Inventor 李娟娟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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