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LED flip chip die attach method

A wafer and die-bonding technology, which is applied in the field of LED flip-chip die-bonding, can solve the problems of low LED flip-chip die-bonding yield rate, complicated process, and high production cost.

Inactive Publication Date: 2015-07-01
JIANGXI LATTICEBRIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for bonding LEDs to solve the problems of low LED flip-chip bonding yield, complicated process and high production cost in the prior art

Method used

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  • LED flip chip die attach method
  • LED flip chip die attach method
  • LED flip chip die attach method

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Embodiment Construction

[0013] The present invention provides a method for bonding LED flip chips, as shown in FIG. 1 . Clean the ceramic bottom plate 1 with alcohol, apply the organic acid flux on the flexible grinding head of the grinding machine, and grind the grinding head on the ceramic bottom plate 1 at a high speed to form a uniform flux layer 2, and use an automatic crystal bonder to apply the solid crystal glue 3 points to the flux layer 2, put the LED flip chip 4 on the die-bonding glue 3, choose a reflow soldering machine with programming function and precise temperature control to heat the module according to the required curve, so that the die-bonding glue Solidification, flux volatilization, cooling, that is, the LED flip-chip die-bonding is realized.

[0014] The above is only a specific implementation mode in the present invention, but the scope of protection of the present invention is not limited thereto. Anyone who is familiar with the technology can easily think of changes or ...

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Abstract

The invention provides an LED flip chip die attach method. The method comprises steps: a flux is coated on a flexible polishing head of a polishing machine, the polishing head performs high-speed polishing on a bottom plate, and a uniform flux layer is formed; a die attach adhesive is dispensed on the flux layer, the LED flip chip is fixedly arranged on the die attach adhesive, a heating device is adopted to carry out heating according to a predetermined temperature curve until the flux is volatilized, cooling is then carried out, and die attach is completed. The problem of a non-uniform adhesive amount during the die attach process can be avoided, the dispensing time can be greatly shortened for a polycrystalline product, the production efficiency is improved, and the cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to a crystal-bonding method for flip-chip LEDs. Background technique [0002] LED (Light Emitting Diode) lamps have the characteristics of long life and low power consumption, and are more and more widely used in the field of lighting. [0003] LED chips are made of semiconductor materials, and the core of the chip is a PN junction. When a corresponding voltage is applied across the PN junction, it can emit light to the outside. With the continuous improvement of the power requirements of LED light sources, the area of ​​LED chips is getting larger and larger, and flip chip (Flip chip) is also more and more widely used due to its advantages such as large effective light-emitting area, but the current LED ceramic packaging products will gradually The package is packaged with a smaller flip-chip, which poses a challenge to the dispensing method of the existing dispe...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/48
CPCH01L33/52H01L33/48
Inventor 张智聪
Owner JIANGXI LATTICEBRIGHT
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