3D (three-dimensional) microwave resonant cavity comprising DC lead structure
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNIV OF SCI & TECH OF CHINA
- Publication Date
- 2015-07-01
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a microwave circuit device, in particular to a 3D microwave resonant cavity including a direct current lead structure. Background technique
[0002] The semiconductor quantum chip is based on the traditional semiconductor industry, making full use of quantum mechanical effects to realize the core components of high-efficiency parallel quantum computing. Qubits, which can be quantum dots or devices such as superconducting quantum interferometers, are the basic units on quantum chips that can store and manipulate quantum information. However, to complete the quantum computing process, it is also necessary to realize the coupling and data exchange between qubits, as well as the detection and readout of quantum information. Ordinary electronic circuits cannot transmit quantum information, so we need some special electronic components to achieve this function for us. Microwave resonators can excite and transmit microwave photons t...