Modified epoxy resin and preparation method thereof, as well as modified epoxy resin composition and preparation method thereof

A technology of epoxy resin and composition, applied in the field of resin, can solve the problems of poor thermal stability and low shrinkage performance

Inactive Publication Date: 2015-07-08
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the thermosetting characteristics of epoxy resins, the reaction between ordinary epoxy resins and curing agents is carried out through direct addition reactions or ring-opening polymeriz

Method used

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  • Modified epoxy resin and preparation method thereof, as well as modified epoxy resin composition and preparation method thereof
  • Modified epoxy resin and preparation method thereof, as well as modified epoxy resin composition and preparation method thereof
  • Modified epoxy resin and preparation method thereof, as well as modified epoxy resin composition and preparation method thereof

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preparation example Construction

[0039] Such as figure 1 The preparation method of the modified epoxy resin of one embodiment shown comprises the steps:

[0040] S110, dissolving the epoxy resin and the furyl compound in an anhydrous organic solvent, and reacting at 50° C. to 100° C. in the presence of a catalyst for 3 h to 10 h to obtain a reaction mixture.

[0041] The epoxy resin is an epoxy resin having at least 2 epoxy groups in the molecule, and the furyl compound is a furyl compound having at least 1 active hydrogen atom in the molecule.

[0042] Epoxy resin has excellent bonding performance and mechanical properties, and has a large number of reactive groups, which is conducive to the introduction of polar groups.

[0043] Preferably, the molar ratio of active hydrogen atoms to epoxy groups is 0.6˜1.2:1.

[0044] Specifically, the epoxy resin may be at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol glycidyl ether, aliphatic glycidyl ether and novolak epoxy resin.

[0045] ...

Embodiment 1

[0067] Preparation of modified epoxy resin.

[0068] Mix 2.6g of novolac epoxy resin DEN431 and 6mL of tetrahydrofuran in a three-necked flask, stir at 65°C for 0.5h, then add 1g of furan methanol and 0.05mL of triethylamine, and react at 65°C for 8h to obtain a reaction mixture . Evaporate the obtained reaction mixture under vacuum conditions to remove tetrahydrofuran to obtain a reaction product, drop the reaction product into diethyl ether to precipitate, and dry to obtain a modified epoxy resin.

[0069] Preparation of modified epoxy resin compositions.

[0070] The obtained modified epoxy resin was dissolved in 50mL dimethylformamide, and a certain amount of N,N'-(4,4'-methylenediphenyl)bismaleimide was added, wherein the modified The molar ratio of epoxy resin to N,N'-(4,4'-methylenediphenyl)bismaleimide is 1:1, stir well and transfer it to a preheated to 60°C placed in a tetrafluoroethylene mold and dried in a vacuum oven to obtain the modified epoxy resin compositio...

Embodiment 2

[0074] Preparation of modified epoxy resin.

[0075] Mix 2.6g of novolac epoxy resin DEN431 and 6mL of tetrahydrofuran in a three-necked flask, stir at 65°C for 0.5h, then add 1g of furan methanol and 0.05mL of triethylamine, and react at 65°C for 8h to obtain a reaction mixture . Evaporate the obtained reaction mixture under vacuum conditions to remove tetrahydrofuran to obtain a reaction product, drop the reaction product into diethyl ether to precipitate, and dry to obtain a modified epoxy resin.

[0076] Preparation of modified epoxy resin compositions.

[0077] The obtained modified epoxy resin was dissolved in 50mL dimethylformamide, and a certain amount of N,N'-(4,4'-methylenediphenyl)bismaleimide was added, wherein the modified The molar ratio of epoxy resin to N,N'-(4,4'-methylenediphenyl)bismaleimide is 2:1, stir well and transfer it to a preheated to 60℃ placed in a tetrafluoroethylene mold and dried in a vacuum oven to obtain a modified epoxy resin composition D...

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Abstract

The invention discloses a preparation method of modified epoxy resin. The preparation method comprises the following steps of dissolving an epoxy resin and furyl compound into an anhydrous organic solvent, and reacting in the existence of a catalyst and at the temperature of 50-100 DEG C for 3-10 hours to obtain a reaction mixture; removing the anhydrous organic solvent in the reaction mixture; dropping the anhydrous organic solvent into an organic precipitator; and separating out and carrying out vacuum drying to obtain modified epoxy resin. According to the preparation method of the modified epoxy resin, the epoxy resin is modified, and active furyl groups are introduced to a molecular structure of the epoxy resin. Furan is a five-membered heterocyclic compound containing oxa-atoms and simultaneously has the chemical performances of aromatic nucleus and alkadiene. Compared with the traditional epoxy resin, the modified epoxy resin prepared by using the preparation method of the modified epoxy resin is relatively high in shrinkage performance and relatively good in thermal stability. The invention also discloses a method for preparing a modified epoxy resin composition by using the prepared modified epoxy resin.

Description

technical field [0001] The invention relates to the field of resins, in particular to a modified epoxy resin and a preparation method thereof, as well as a modified epoxy resin composition prepared by using the modified epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin has good mechanical properties, electrical insulation, adhesion, etc., and is widely used in various fields such as coatings, adhesives, laminates, and electronic packaging. [0003] However, due to the thermosetting characteristics of epoxy resins, the reaction between ordinary epoxy resins and curing agents is carried out through direct addition reactions or ring-opening polymerization reactions of epoxy groups in resin molecules. Since there is no water or other volatile by-products The product is released, the shrinkage performance is relatively low, and the thermal stability is poor. Contents of the invention [0004] Based on this, it is necessary to provide a mod...

Claims

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Application Information

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IPC IPC(8): C08G59/14C08L63/00C08K5/3415C08K5/378
Inventor 孙蓉李金辉张国平龚征宇
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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