A kind of pcb design method and system
A design method and design system technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve problems such as insufficient information for board manufacturers, inability to accurately distinguish surface treatment processes, etc., to reduce the probability of process errors and improve work efficiency. Effect
Active Publication Date: 2018-09-28
矽谷电子科技(东莞)有限公司
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a PCB design method and system to solve the problem in the prior art that board manufacturers cannot accurately distinguish the surface treatment process due to insufficient PCB design data information
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0026] The PCB design method and system of the present invention can be applied to existing PCB layout design software and implemented through software. The PCB layout design software includes: Cadence allegro, Altium Designer, PADS, Mentor WG, etc.
[0027] Such as figur...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a PCB design method and system. A surface processing technology adopted for the surface of a PCB suitable for the encapsulation information of an electronic element to be installed in selected. A corresponding technology wiring layer is established according to the surface processing technology, and part information of a PCB part used for being correspondingly connected with the electronic element is associated with of the technology wiring layer information. By means of the PCB design method and system, the technology information can be directly shown in a part library when an encapsulating library is established, the technology wiring layer information provided for a board manufacturer is exported and includes the element information associated with the same surface processing technology, the working efficiency is improved, and the probability of causing technology errors due to error communication is also reduced.
Description
technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a PCB design method and system. Background technique [0002] Common surface treatment technologies in the manufacture of printed circuit boards (PCB) mainly include: hot air leveling, chemical immersion nickel gold, whole board electroplating nickel gold, organic coating (OSP), chemical immersion silver and chemical immersion tin, etc. Although these treatment methods are widely used, each has its limitations. Therefore, the mixed surface treatment technology is usually used to complement each other, integrate the advantages of various surface treatment technologies, and effectively solve their respective shortcomings. [0003] Let's take the OSP and immersion gold process on our mobile phone as an example: [0004] At present, engineers usually only provide the board manufacturer with the pad layer and the solder layer according to the predetermined st...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 潘权菊
Owner 矽谷电子科技(东莞)有限公司