SOP8 package lead frame of high-power LED driving chip

Abstract

The invention discloses an SOP8 package lead frame of a high-power LED driving chip. The SOP8 package lead frame comprises a pin, side connection ribs, a first island and a second island, the pin and the two side connection ribs together support the first island and the second island, the width of the first island is larger than the standard width of an SOP8 package island, and the width of the second island is smaller than the standard width of the SOP8 package island. The size of the largest MOSFET chip borne by the first island is increased, and the SOP8 lead frame is suitable for packaging a 3 W-9 W built-in isolation type LED driving chip or a 12 W-24 W built-in isolation type LED driving chip and is wide in application range. The bearing area of the first island is correspondingly increased, and therefore the heat dissipation performance is good. No special requirements for the MOSFET chip exist, and therefore the cost is low; only one pin is needed, and therefore expandability is good. The SOP8 package lead frame can be widely applied to the field of semiconductor components.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a SOP8 packaging lead frame for a high-power LED driver chip. Background technique [0002] The package of SOP8 is a very popular small patch type, which is generally adopted by the current semiconductor chip package. The SOP8 package is only 2 / 5 of the area occupied by the DIP8 package, and when the PCB board is soldered, the SOP8 package has the incomparable advantages and efficiency of the DIP8 plug-in package. A brief comparison of the key dimensions of the SOP8 package and the DIP8 package is shown in the figure figure 1 shown. [0003] The built-in isolated LED driver chip needs to package an IC control chip and a MOSFET chip with a withstand voltage of 650V in a SOP8 or a DIP8 package. ) is lower, the lower the turn-on resistance of the MOSFET chip means the larger the chip area. [0004] like figure 2 and image 3 As shown, the existing SOP8 package lead frame ...

AI Technical Summary

Problems solved by technology

[0006] Furthermore, the existing SOP8 lead frame with a built-in isolated LED driver chip uses two adjacent pins 1 and a side connecting rib 4 connected to the base island 2 for support (such as figure 2 shown), so that the number of effective pins in the SOP8 package is reduced to 6, which reduces the number of effective pins by 2, which is not conducive to the functional expansion of the LED driver chip

Images