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LTCC-LTCF composite circuit substrate structure

A LTCC-LTCF, circuit substrate technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problem that a single LTCC cannot achieve integrated miniaturization of a single LTCF in the integrated design of microwave circuits, and achieve the effect of strong practical value.

Inactive Publication Date: 2015-07-15
SOUTHWEST INST OF APPLIED MAGNETICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems in the prior art, the present invention provides a LTCC-LTCF composite circuit substrate structure, which is used to solve the problem that a single LTCC in the prior art cannot achieve integrated miniaturization and a single LTCF has great difficulties in the integrated design of microwave circuits. The problem

Method used

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  • LTCC-LTCF composite circuit substrate structure
  • LTCC-LTCF composite circuit substrate structure
  • LTCC-LTCF composite circuit substrate structure

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Example 1: figure 1 It is a "3C + 3F + 2C" composite laminated circuit substrate structure. Among them, the conductors with serial numbers 7 to 13 and the LTCF layer constitute the "magnetic component layout layer", and the integrated design of magnetic components such as inductors and transformers is carried out in this area (LTCF layer is used as the magnetic core, and the conductors printed on the LTCF layer Graphics constitute inductors or transformer coils); two layers of conductors with serial numbers 5 and 15 respectively form an "intermediate shielding layer" to isolate magnetic components from other circuits; the remaining LTCC layers and conductor layers are used for integrated design of capacitors and RF components and other circuit lines; the circuit patterns of each layer are connected through metal vias.

Embodiment 2

[0030] Example 2: figure 2 for in figure 1 Based on the modified "3C + 3F + 2C" composite laminated circuit substrate structure. The difference with Example 1 is that in figure 2 Among them, there is no conductor layer between the LTCF layers numbered 8 to 10, and the 3 layers of LTCF are directly stacked into a thicker ferrite layer to meet the design requirements.

Embodiment 3

[0031] Example 3: image 3 It is a "2C + 1F + 2C + 1F + 2C" composite laminated circuit substrate structure. Among them, the conductors with serial numbers 5-7 and the LTCF layer constitute the "magnetic component layout layer 1", while the conductors with serial numbers 11-13 and the LTCF layer constitute the "magnetic component layout layer 2". Different magnetic component patterns are designed in the magnetic component layout layer 1 and the magnetic component layout layer 2 respectively, and they are separated by the "intermediate shielding layer" with the serial number 9; the remaining LTCC layers and conductor layers are used for the integrated design of capacitors , RF components and other circuit lines; the circuit patterns of each layer are connected through metal vias.

[0032] "3C" in the above description refers to 3 layers of continuous LTCC tiles, "3F" refers to 3 layers of continuous LTCF tiles, and so on. "Continuous" here means that there is no space between...

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Abstract

The invention relates to the field of integrated circuits and discloses an LTCC-LTCF composite circuit substrate structure. The structure is composed of LTCC ceramic chip layers and LTCF ceramic chip layers, LTCC ceramic chips and LTCF ceramic chips are basic superposition units, and the LTCC ceramic chip layers and the LTCF ceramic chip layers are arrayed in a superposed mode. The structure has the advantages that by means of the structure, the conventional LTCC integrated circuit design can be achieved, meanwhile, the magnetic characteristic of LTCF materials is utilized, magnetic elements such as inductors and transformers are integrated into the LTCF layers, thereby the defect that in the conventional LTCC integration technology, the magnetic elements such as the large inductors and the transformers are difficult to integrate is overcome, and the integration of the magnetic elements, non-magnetic elements and circuits is achieved. By means of the composite circuit substrate structure, further integrated miniaturization of a circuit module is facilitated, and great practical value is achieved.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an LTCC-LTCF composite circuit substrate structure. Background technique [0002] As a kind of integrated circuit technology, LTCC technology has been quite mature, which has played a positive role in the miniaturization of circuit modules. LTCF technology is developed from LTCC technology. It uses ferrite materials and uses the magnetic properties of ferrite to realize the integrated design of components such as inductors and transformers. Both LTCC technology and LTCF technology have their own advantages, and their defects are also obvious. Due to the material characteristics of conventional LTCC technology, it is difficult to integrate components such as large inductors and transformers. It is true that the circuit can be realized by installing discrete inductors and transformers in the form of surface mount. function, but it cannot achieve the purpose of integrated miniat...

Claims

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Application Information

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IPC IPC(8): H05K1/03
Inventor 张卫张菊燕王升陈轲
Owner SOUTHWEST INST OF APPLIED MAGNETICS
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