Supercharge Your Innovation With Domain-Expert AI Agents!

DIN type high intermodulation waterproof electric bridge

A waterproof bridge, high intermodulation technology, applied in circuits, electrical components, waveguide devices, etc., can solve the problems of difficult to withstand high power, insufficient selling price and low cost, and achieve the effect of reducing production cost and high power

Inactive Publication Date: 2015-07-29
合肥凯蒙新材料有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The frequency of the widely used 3dB bridge is between 800-2500MHz. With the development of technology, the requirements for communication technology are getting higher and higher. Passive products such as , attenuator, etc., not only use more DIN type couplers to increase power, but also put forward higher requirements such as three-media intermodulation, IP65 waterproof, etc., among which the bridge is the most obvious, and put forward higher high Power, same input and output, three media intermodulation, IP65 waterproof and other requirements, but if all these requirements are realized in the 800-2500MHz bridge, it is difficult to achieve, because the high power is required, so the microstrip line design cannot be used, and the microstrip line design cannot be used. The metal thickness of the strip line is only 0.035mm, which is difficult to withstand high power, and because of the requirement of the same input and output, the commonly used strip line structure bridge is not good, and the design of the columnar structure may not be sold at the price or even the cost. What's more, there are three intermodulation, IP65 waterproof and other requirements that need to be met

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • DIN type high intermodulation waterproof electric bridge
  • DIN type high intermodulation waterproof electric bridge

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] refer to Figure 1-2 , a DIN type high intermodulation waterproof electric bridge, which consists of a lower cavity 1, an inner cover 2, and an outer cover 3, an inner cover 2 is installed above the lower cavity 1, and an outer cover is arranged above the inner cover 2 plate 3.

[0015] The inner cover 2 is aligned with the upper surface of the lower cavity 1, and there is a waterproof groove 4 between the inner cover 2 and the lower cavity 1.

[0016] The lower cavity 1 is provided with a microstrip line 5, and the upper and lower sides of the microstrip line 5 are respectively provided with a dielectric plate 6, and the outer surface of the dielectric plate 6 is respectively provided with an additional dielectric plate 7, and the microstrip line 5 includes There is a first-order coupling zone 5.1,

[0017] The additional dielectric plate 7 is arranged on the outer layer of the upper and lower dielectric plates 6 at the position of the primary coupling area 5.1 of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a DIN type high intermodulation waterproof electric bridge and relates to the technical field of electric bridges. The DIN type high intermodulation waterproof electric bridge is formed by a lower cavity, an inner cover plate and an outer cover plate, wherein the inner cover plate is arranged above the lower cavity, the outer cover plate is arranged above the inner cover plate, a waterproof groove is formed between the inner cover plate and the lower cavity, a micro-strip line is arranged in the lower cavity, dielectric slabs are arranged above and below the micro-strip line respectively, and additional dielectric slabs are arranged on the outer surfaces of the dielectric slabs respectively. The DIN type high intermodulation waterproof electric bridge has a high power, achieves in and out simultaneously, reaches three-dielectric intermodulation, can resist water, and not only meets functional requirements but also reduces production cost.

Description

Technical field: [0001] The invention relates to the technical field of electric bridges. Background technique: [0002] The frequency of the widely used 3dB bridge is between 800-2500MHz. With the development of technology, the requirements for communication technology are getting higher and higher. Passive products such as , attenuator, etc., not only use more DIN type couplers to increase power, but also put forward higher requirements such as three-media intermodulation, IP65 waterproof, etc., among which the bridge is the most obvious, and put forward a higher high Power, same input and output, three media intermodulation, IP65 waterproof and other requirements, but if all these requirements are realized in the 800-2500MHz bridge, it is difficult to achieve, because the high power is required, so the microstrip line design cannot be used, and the microstrip line design cannot be used. The metal thickness of the strip line is only 0.035mm, which is difficult to with...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/12
Inventor 不公告发明人
Owner 合肥凯蒙新材料有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More