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Deplating solution for stripping nickel layer on copper layer, and preparation method and deplating method thereof

A technology for stripping solution and nickel layer, which is applied in the field of stripping solution for stripping nickel layer on the surface of copper layer and its preparation field, can solve problems such as corrosion of copper layer, and achieve the effect of reducing corrosion rate and preventing corrosion

Active Publication Date: 2015-09-02
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem that the existing stripping solution for stripping the nickel layer on the copper layer corrodes the copper layer, the present invention provides a stripping solution that does not corrode the copper layer and its preparation method and stripping method

Method used

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preparation example Construction

[0016] The present invention also provides the preparation method of the above-mentioned deplating solution, wherein the first corrosion inhibitor, the second corrosion inhibitor and the oxidizing agent are dissolved in water to form a mixed solution which is the deplating solution.

[0017] The present invention also provides a stripping method, which comprises immersing the substrate whose surface is sequentially coated with a copper layer and a nickel layer in a stripping solution for stripping, and stripping off the nickel layer on the surface of the copper layer; wherein, the The stripping solution is the stripping solution of the present invention.

[0018] According to the stripping method provided by the present invention, preferably, the temperature of the stripping solution is 80-100°C.

Embodiment 1

[0021] 1. Preparation of deplating solution

[0022] Mix and dissolve ethylenediamine 170g / L, triethanolamine 70g / L, benzotriazole 7g / L, 2-methylformamide 70g / L and sodium m-nitrobenzenesulfonate 80g / L to obtain stripping solution A1 .

[0023] 2. Deplating Take a piece of ABS plastic workpiece with a nickel layer on the copper layer. The nickel layer is about 5 microns. Then put it into the deplating solution A1 for deplating, the temperature of the deplating solution is 80°C, and the deplating time is 67s. Get stripped piece B1.

Embodiment 2

[0025] 1. Preparation of deplating solution

[0026] Mix and dissolve ethylenediamine 120g / L, triethanolamine 10g / L, benzotriazole 3g / L, 2-methylformamide 30g / L and sodium m-nitrobenzenesulfonate 60g / L to obtain stripping solution A2 .

[0027] 2. Deplating

[0028] Take a piece of ABS plastic workpiece with a nickel layer on the copper layer, the nickel layer is about 5 microns. Then put it into the deplating solution A2 for deplating, the temperature of the deplating solution is 100°C, and the deplating time is 78s. Get stripped piece B2.

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PUM

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Abstract

The invention provides a deplating solution for stripping a nickel layer on a copper layer, and a preparation method and a deplating method thereof. The deplating solution comprises a first corrosion inhibitor and an oxidant; and the first corrosion inhibitor is 2-methylmethanamide. The deplating solution can simultaneously guarantee nickel layer deplating and prevent corrosion of the copper layer.

Description

technical field [0001] The invention belongs to the field of electroplating, and in particular relates to a stripping solution for stripping a nickel layer on the surface of a copper layer, a preparation method thereof and a stripping method. Background technique [0002] In the modern electroplating process, it is often necessary to plate nickel on the copper layer to play the role of anti-corrosion, anti-rust, and over-plating of other metals. But sometimes, because the nickel layer is prone to quality problems during the nickel-plating process of the copper layer, it needs to be stripped and re-plated with nickel. However, ordinary strippers often also strip the copper layer, resulting in scrapped products. The existing nickel stripping process on the copper layer mainly includes electrolysis, but the electrolysis method is more troublesome, especially the stripping of plastic workpieces requires special hangers, and some workpieces cannot be stripped due to poor conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/14
Inventor 韦家亮
Owner BYD CO LTD