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Bondable multilayer ceramic capacitor and manufacturing method thereof

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor leads, fixed capacitor parts, etc., can solve the problems of difficult alignment of via holes, cutting defects, and difficult capacitors, etc., to increase the connection effect , improve connectivity, increase the effect of capacitance

Active Publication Date: 2015-09-09
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Capacitors of this structure may cause block deformation during lamination or compression, causing cutting defects, and are also prone to chipping or cracking when installed inside the circuit board
Chinese Patent Application Publication No. CN 1832070 filed by Samsung Electro-Mechanics Co., Ltd. shows a highly reliable bondable multilayer chip capacitor that utilizes vias to connect internal electrodes to external electrodes with relatively little chipping , However, in the lamination process, it is difficult to fully align the via holes, so it is easy to form poor electrode contact, and it is not easy to make small-sized capacitors

Method used

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  • Bondable multilayer ceramic capacitor and manufacturing method thereof
  • Bondable multilayer ceramic capacitor and manufacturing method thereof
  • Bondable multilayer ceramic capacitor and manufacturing method thereof

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Embodiment Construction

[0026] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. More specifically, the present invention can be implemented in many different forms and is not limited by the embodiments described herein. Throughout the specification, the same or equivalent elements are marked with the same reference numerals.

[0027] figure 1 Schematically shows a cross-sectional view of a bondable multilayer ceramic capacitor passing through a via hole in the x direction and the y direction according to an embodiment of the present invention; Figure 2a to Figure 2b is schematically shown figure 1 A perspective view of a structure of bondable first and second internal electrodes of a multilayer ceramic capacitor; and Figure 3a to Figure 3b is schematically shown figure 1 A perspective view of the structure of the upper and lower external electrodes on the top and bottom of a bondable multilayer ceramic capacit...

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Abstract

The invention provides a bondable multilayer ceramic capacitor high in reliability and high in electric capacity, and a manufacturing method thereof. The bondable multilayer ceramic capacitor includes multiple ceramic dielectric layers, multiple first and second inner electrodes that are alternatively formed on the multiple ceramic dielectric layers, and first-type and second-type vertical passing holes that vertically penetrate the multiple ceramic dielectric layers. The first-type vertical passing holes are connected to main electrodes of the first inner electrodes, and the second-type vertical passing holes are connected to main electrodes of the second inner electrodes. The first-type vertical passing holes extend till the bottom of the capacitor and are connected to an outer electrode at the bottom. The second-type vertical passing holes extend till the top of the capacitor and are connected to an outer electrode on the top.

Description

technical field [0001] The present invention relates to a multilayer ceramic capacitor. More specifically, the present invention relates to a bondable multilayer ceramic capacitor with high reliability and high capacity density and a method for preparing the bondable multilayer ceramic capacitor. Background technique [0002] Traditional three-dimensional discrete passive components are prepared by insertion, welding, surface mount, etc. As the electronics industry develops towards miniaturization, micro-assembly processes gradually replace insertion, welding, surface mount, and other processes. The key to the micro-assembly process is the bonding of components. Bondable passive component technology can meet the needs of reducing the number of components, compressing the size of the circuit board, increasing the function of the circuit board, and reducing the overall cost of the product. In electronic equipment, capacitors are one of the three main passive components, and ...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/232
Inventor 顾燕刘志甫李永祥庄彤冯毅龙杨俊峰
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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