Copper wire material for bonding wire and method for producing copper wire material for bonding wire

A technology for bonding wires and wires, which is used in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., can solve the problems of reduced productivity, wire breakage, insufficient wire extensibility, etc. Line and good workability

Active Publication Date: 2019-05-17
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, when manufacturing the bonding wires disclosed in Patent Documents 1 and 2, if the copper wire for bonding wire is processed to a wire diameter of, for example, 10 μm by wire drawing, the stretchability of the wire rod is not sufficient, and the wire rod frequently occurs. disconnected
If wire breakage occurs during wire drawing of copper wires for bonding wires in this way, there will be a problem that the productivity will drop significantly.

Method used

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  • Copper wire material for bonding wire and method for producing copper wire material for bonding wire
  • Copper wire material for bonding wire and method for producing copper wire material for bonding wire

Examples

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Effect test

Embodiment

[0055] Hereinafter, the results of confirmation experiments conducted to confirm the effectiveness of the present invention will be described.

[0056] (Examples 1 to 5 of the present invention)

[0057] First, a steel billet with a diameter of 250 mm and a length of 700 mm made of high-purity copper having a purity of 99.9999% by mass or higher was prepared. This billet was heated to 800° C., and subjected to hot extrusion processing to produce a wire rod with a diameter of 8 mm.

[0058] Next, the wire rod with a diameter of 8 mm was subjected to wire drawing including cold peeling and wire drawing until the diameter reached 1 mm. In addition, in this wire drawing process, the reduction of area was set to 98%, and the number of passes was set to 15 times.

[0059] Next, the drawn wire rod was charged into a batch annealing furnace, and heat-treated at the heating temperature and heating time shown in Table 1. In addition, the atmosphere of the batch type annealing furnace...

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Abstract

The copper wire material for bonding wires of the present invention is a copper wire material for bonding wires for forming bonding wires, which is composed of high-purity copper with a purity of 99.9999% by mass or more, has a wire diameter of 0.5 mm to 3.5 mm, and is perpendicular to the wire drawing direction. The area ratio of the (001) plane in the cross section is not less than 15% and not more than 30%.

Description

technical field [0001] The present invention relates to a copper wire material for bonding wires for forming bonding wires. [0002] This application claims priority based on Patent Application No. 2013-213114 for which it applied in Japan on October 10, 2013, and uses the content here. Background technique [0003] Generally, in a semiconductor device mounting a semiconductor element, the semiconductor element and leads are connected by bonding wires. Conventionally, Au wires have been mainly used as bonding wires from the viewpoint of stringiness, conductivity, and the like. However, since Au is expensive, bonding wires made of Cu wires are provided as bonding wires instead of Au wires. [0004] A bonding wire made of Cu wire is manufactured, for example, by drawing a cast material with a wire diameter of 4 mm to 8 mm to 0.5 mm as a copper wire for bonding wire, and then further wire-drawing the copper wire for bonding wire. Wire diameter 30μm processed to 50μm. For ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60C22C9/00C22F1/00C22F1/08
CPCH01L24/43H01L24/45H01L2224/43848H01L2224/45015H01L2224/4321H01L2224/45144H01L2224/45147H01L2924/01206H01L2924/2075H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755H01L2924/20756H01L2924/20757H01L2924/20758H01L2924/20759H01L2924/2076H01L2924/00014H01L2924/20106H01L2924/20107H01L2924/00C22C9/00C22F1/08
Inventor 熊谷训谷雨佐藤雄次
Owner MITSUBISHI MATERIALS CORP
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