Overflow film forming substrate through column filling method
A filling method and substrate technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as many limited conditions, peeling and fracture, surface depression, etc., and achieve low cost, dense structure, and smooth surface. Effect
Active Publication Date: 2015-09-16
SHANDONG INST OF AEROSPACE ELECTRONICS TECH
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Problems solved by technology
[0004] Aiming at the problems that the traditional through-pillar filling method has many restrictions, cumbersome steps, and defects such as surface depression, shedding, and fracture, the present invention proposes a through-pillar filling method for overflow film-forming substrates, which can achieve a flat surface. The production of through-pillars eliminates defects such as shedding and breakage due to the depression on the surface of the through-pillars, and improves the reliability of the product
Method used
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[0028] The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0029] 1. Stage 1 preparation
[0030] A layer of dust-free cloth 2 is first laid on the stage 1 of the printing machine, and then a layer of stainless steel wire mesh 3 is laid. After the stainless steel wire mesh 3 is pressed tightly, the surroundings of the wire mesh are fixed with adhesive tapes.
[0031] 2. Fix the positioning pin 4 on the stainless steel wire mesh 3, the thickness of the positioning pin 4 is 1 / 2-2 / 3 of the thickness of the substrate. Place the film-forming substrate in the corresponding area of the positioning pin 4 . Each time the film-forming substrate is fixed, it is placed in the corresponding area of the positioning pin 4, which can save the positioning procedure.
[0032] 3. Install the stainless steel stencil on the screen frame of the printing machine, and adjust the screw scales in the X and Y directions of the printi...
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Abstract
The invention discloses an overflow film forming substrate through column filling method. By using an open stainless steel mesh plate on the front and laying a stainless steel silk screen on the back as a supporting base, two-sided overflow through column filling is realized. As overflowed slurry makes up for shrinkage loss of a through column in the process of sintering, a through column made by the method has a flush surface and a compact structure, and has higher reliability than other through columns. The stainless steel silk screen below the substrate is used as a supporting base to collect slurry overflowed by the through column, which not only ensures the integrity and density of through column filling, but also avoids large-area contamination on the surface of the substrate caused by overflowed slurry. Compared with an injection method and a vacuum extraction method, the method of the invention has the advantages of wide process window, simple operation, low cost, and high reliability.
Description
technical field [0001] The invention relates to the technical fields of high-density multilayer substrate manufacturing and 3D-MCM packaging, in particular to an overflow-type film-forming substrate through-pillar filling method. Background technique [0002] The so-called through column refers to the circular column that runs through the upper and lower surfaces of the film-forming substrate, such as figure 1 As shown, it connects the contact areas on the upper and lower sides of the substrate, and plays the role of realizing the electrical connection between the upper and lower surfaces of the substrate. With the continuous development of hybrid integrated circuits in the direction of three-dimensional assembly, the demand for substrate through-pillar interconnection is becoming stronger and stronger. At present, there are two main methods for making solid vias: one is the injection filling method, that is, the filling of the vias is achieved by injecting conductive paste...
Claims
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Login to View More IPC IPC(8): H01L21/48
CPCH01L21/486
Inventor 王尚智孙鲁威邱海燕林喜涛张令文赵丹任泽亮
Owner SHANDONG INST OF AEROSPACE ELECTRONICS TECH