Double-door gate valve device and film coating equipment with same

Abstract

The invention discloses a double-door gate valve device which comprises a base, two gate units and a conveying unit, wherein the base comprises a ring cavity wall, an inlet end wall which is positioned at one end of the ring cavity wall and provided with a valve inlet opening, an outlet end wall which is positioned at the other end of the ring cavity wall and provided with a valve outlet opening, an interval wall which is positioned between the inlet end wall and the outlet end wall and provided with an interval valve opening, and an air exhaustion opening. A buffer cavity is co-defined by the ring cavity wall, the inlet end wall and the interval wall. A joining cavity is co-defined by the ring cavity wall, the interval wall and the outlet end wall. The gate units are correspondingly arranged in the buffer cavity and the joining cavity respectively, and are used for opening and closing the valve inlet opening and the interval valve opening respectively to generate dual-isolation effect; besides, a distance between the inlet end wall and the outlet end wall is not greater than 500 mm, so that the equipment cost is reduced.

Description

technical field [0001] The invention relates to a gate valve device, in particular to a double gate valve device and coating equipment with the double gate valve device. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, PVD) is a technology that uses physical changes to deposit thin films on a workpiece in a high-vacuum deposition environment. Among them, in order to allow the workpiece to enter and exit the deposition environment from atmospheric pressure, the coating equipment must be progressively vacuum-isolated by a gate valve device, and the deposition environment can be restored to a highly airtight state by using the gate valve device, so that the vacuum can be continuously carried out. Coating process. However, the gate valve device tends to accumulate a thick film due to being overcoated for a long time, thereby reducing the isolation effect, causing the vacuum degree of the deposition environment to deteriorate, and further affec...

AI Technical Summary

Problems solved by technology

By means of the setting of the buffer chamber 93, although the gate valve 94 adjacent to the unloading chamber 92 can be prevented from being overflow plated to maintain the airtight isolation of the process chamber 91, the chamber needs to be individually connected to a negative pressure source (not shown) to construct a progressive negative pressure environment, thus increasing the construction cost and floor space of the coating equipment

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