Slice thickness measurement apparatus based on laser induction

A technology of laser induction and thickness measurement, which is applied in the field of measurement, can solve problems such as different measurement values, large influence by temperature, interference, etc., and achieve the effects of high measurement accuracy, convenient use, and simple structure

Inactive Publication Date: 2015-09-23
SUZHOU HEXINMEI ELECTRONICS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, ultrasonic thickness gauges are based on ultrasonic measurements, which cannot avoid the inherent defects of ultrasonic waves:
[0011] 1. The emission angle is relatively large, and the high-frequency ultrasonic short-range measurement is also 7-8°, and the low-frequency long-distance measurement angle is 20-30°;
[0012] 2. It is easy to be disturbed by smoke, dust and raindrops;
[0013] 3. It is greatly affected by temperature, and the measured values ​​at different temperatures are different

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The technical scheme of the present invention is described in further detail below:

[0039] The invention discloses a sheet thickness measuring device based on laser induction, which comprises an upper plate, a lower plate, a first infrared emitter, a first infrared receiver, a second infrared emitter, a second infrared receiver, a control module, and a clock modules and display modules;

[0040] The control module is electrically connected to the first infrared transmitter, the first infrared receiver, the second infrared transmitter, the second infrared receiver, the clock module, and the display module;

[0041] Both the upper plate and the lower plate are smooth and arranged in parallel;

[0042] The first infrared transmitter and the first infrared receiver are arranged on the upper board, and the first infrared receiver is used to receive the reflected infrared rays emitted by the first infrared transmitter and send and receive signals to the control module;

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Abstract

The invention discloses a slice thickness measurement apparatus based on laser induction. The apparatus comprises an upper plate, a lower plate, a first infrared emitter, a first infrared receiver, a second infrared emitter, a second infrared receiver, a control module, a clock module and a display module. The control module is electrically connected to the first infrared emitter, the first infrared receiver, the second infrared emitter, the second infrared receiver, the clock module and the display module respectively. The upper plate and the lower plate are smooth planes and are arranged in parallel. The first infrared emitter and the first infrared receiver are arranged on the upper plate. The second infrared emitter and the second infrared receiver are arranged on the lower plate. An emission direction of the first infrared emitter is vertical to the lower plate. An emission direction of the second infrared emitter is vertical to the upper plate. Straight lines where the first infrared emitter and the second infrared emitter are located are vertical to the upper plate and the lower plate respectively. The structure is simple, usage is convenient, measurement precision is high and a speed is fast.

Description

technical field [0001] The invention relates to the measurement field, in particular to a thin sheet thickness measuring device based on laser induction. Background technique [0002] Measurement is to use data to describe the observed phenomenon according to a certain law, that is, to make a quantitative description of things. Measurement is the process of quantifying non-quantified objects. In mechanical engineering, measurement refers to the experimental cognition process of comparing the measured value with a standard quantity with a measurement unit in order to determine the ratio between the two. [0003] Measurement is the first step in all physical research. The accuracy of measurement directly affects subsequent research and calculation. Without measurement, there will be no source of a series of physical quantities and data, and research and calculation cannot continue. [0004] Thickness measurement is the measurement of the thickness of the item. When the item ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G01B11/06
Inventor胡国良
OwnerSUZHOU HEXINMEI ELECTRONICS SCI & TECH CO LTD