Solder distribution of a heat dissipation module of a semiconductor device

Abstract

A solder distribution structure of a semiconductor device heat dissipation module, the structure includes a heat sink, a first solder layer, a second solder layer, and a chip; the first solder layer is arranged above the heat sink, the second solder layer is arranged on the side of the heat sink and It is connected with the first solder layer, and the chip is arranged above the first solder layer, which is an upper and lower electrode structure. By growing a layer of second solder layer on one side of the heat sink, the function of the second solder layer is mainly to guide the raised first solder layer to flow to the side of the heat sink during the sintering process, thereby effectively preventing the first solder layer from The layer climbs toward the die, so that the problem of short circuit or light blocking of the die caused by the first solder layer climbing toward the die can be effectively prevented, and the yield, reliability and stability of the device are improved.

Description

technical field [0001] The invention relates to solder distribution of a heat dissipation module of a semiconductor device, belongs to the field of semiconductor device manufacturing, and relates to a preparation process of a heat dissipation module of a semiconductor device. Background technique [0002] Semiconductor devices refer to discrete devices made of semiconductor materials. According to different semiconductor materials, different processes and geometric structures, researchers have developed a variety of semiconductor devices with different functions. These semiconductor devices are widely used in information storage, communication, military and medical fields. This requires semiconductor devices to have the characteristics of excellent performance, small size, light weight and low power consumption. In order to achieve the above goals, very high requirements are put forward for the manufacturing process of the semiconductor device heat dissipation module. [...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned problem that the solder bulges easily caused by the heat sink and the tube core during the sintering process, and climbs to the tube core to cause a short circuit or light blocking of the tube core, the present invention provides a solder distribution structure for a heat dissipation module of a semiconductor device. It can effectively guide the solder to flow toward the heat sink during sintering, prevent the solder from cooling into a ball after cooling down, and climb to the die to cause light blocking and chip short circuit, effectively solving the problem of short circuit or short circuit in the sintering process of existing semiconductor devices The problem of light blocking improves the yield, reliability and stability of the device

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