Substrate having metal layer and manufacture method for the same

Abstract

The invention discloses a substrate having a metal layer and a manufacture method for the same. The method comprises steps of S1 adhering a metal film on an insulation film substrate, S2 cutting lines on the metal film and forming a cutting area between the adjacent cutting lines, and S3 separating the metal film strip on the cutting area from the metal film to form a substrate having the metal layer, wherein the substrate having the metal layer comprises a first metal line, a second metal line and a middle metal line, and the middle metal line is positioned between the first metal line and the second metal line. The invention improves the production efficiency of the substrate having the metal layer and is applicable to the LED lamp strip.

Description

【Technical field】 [0001] The invention relates to a substrate with a metal layer and a manufacturing method thereof. 【Background technique】 [0002] LED is a light-emitting diode, a new technology developed in the middle of the 20th century. [0003] At present, LED light strips generally use LEDs to be assembled on a strip-shaped FPC (flexible circuit board) or LED wiring board. However, the production process of the currently known traditional etching ink flexible circuit board needs to go through cutting, drilling, wiring, exposure, green oil, etching, printing, electrical measurement, etc. The production process is complicated and the cost is very high. The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and the production efficiency of splicing and cutting is extremely low, about 3 meters per minute. [0004] The other process wire plate is similar to traditional cables in the pro...

AI Technical Summary

Problems solved by technology

However, the production process of the known traditional etching ink flexible circuit boards needs to go through board cutting, drilling, wiring, exposure, green oil, etching, printing, electrical testing, etc. The production process is complicated and the cost is high.

The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and requires splicing and cutting. The production efficiency is extremely low, and the production rate is about 3 meters per minute.

[0004] The other process wire plate is similar to traditional cables in the production process. Although it does not need electroplating, etching, pickling and drilling processes, it needs to press flat copper strips and then press for production. The production process is expensive. The accuracy is poor, the production capacity is extremely low (0.8 meters per minute for the metal stamping die), and the process is unstable. The copper wire is easy to shift. Risk of conduction due to breakdown

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