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Polyamide imide resin and manufacturing method of polyamide imide resin

A technology of polyamide-imide resin and polyamide-imide, which is applied in the field of polyamide-imide resin, and can solve problems such as the decline of industrial productivity and the increase of operating costs

Active Publication Date: 2015-10-14
AIR WATER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This change in waste liquid treatment may lead to a decrease in industrial productivity such as the need for huge equipment investment and increased operating costs.

Method used

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  • Polyamide imide resin and manufacturing method of polyamide imide resin
  • Polyamide imide resin and manufacturing method of polyamide imide resin
  • Polyamide imide resin and manufacturing method of polyamide imide resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0071] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to this.

Synthetic example 1

[0073] At room temperature, 2,2-bis[4-(4-aminophenoxy)phenyl]propane (hereinafter referred to as "BAPP") 6.98 g, 3.80 g of 3,5-diaminobenzoic acid, 8.21 g of JEFFAMINE XTJ-542 (manufactured by Huntsman, molecular weight 1025.64), and 86.49 g of γ-butyrolactone were dissolved.

[0074] Next, 17.84 g of cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and 2.88 g of trimellitic anhydride were charged, and kept at room temperature for 30 minutes. 30 g of toluene was also charged, and after heating up to 160 degreeC and removing the produced water together with toluene, it held and cooled to room temperature for 3 hours, and obtained the imide compound solution.

[0075] 9.61 g of trimellitic anhydride and 17.45 g of trimethylhexamethylene diisocyanate were put in the obtained imide solution, and it held at the temperature of 160 degreeC for 32 hours. In this way, a carboxyl group-containing polyamideimide resin solution (A-1) was obtained. The solid content was 40.1%, and the ...

Synthetic example 2

[0077] At room temperature, 10.84 g of BAPP, 3.01 g of 3,5-diaminobenzoic acid, and 9.03 g of JEFFAMINE XTJ-542 (manufactured by HUNTSMAN, molecular weight 1025.64) were placed in a 300 mL four-necked flask equipped with a nitrogen gas introduction tube, a thermometer, and a stirrer. and 95.90 g of γ-butyrolactone and dissolved.

[0078] Next, 19.62 g of cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and 3.17 g of trimellitic anhydride were charged and kept at room temperature for 30 minutes. 30 g of toluene was also added, and the temperature was raised to 160° C. to remove generated water together with toluene, and then kept for 3 hours and cooled to room temperature to obtain an imide solution.

[0079] 10.57 g of trimellitic anhydride and 16.65 g of trimethylhexamethylene diisocyanate were put in the obtained imide solution, and it held at the temperature of 160 degreeC for 32 hours. In this way, a carboxyl group-containing polyamideimide resin solution (A-2) was obta...

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Abstract

The present invention provides polyamide imide resin and a manufacturing method of polyamide imide resin. The polyamide imide resin has moderate alkali solubility that the polyamide imide resin can also be solved even if the 1.0 mass % sodium carbonate aqueous solution is used as the alkali solution. The polyamide imide resin is prepared by reaction of reaction raw materials (alpha) including imide compound (A) and diisocyanate compounds (h), wherein the imide compound (A) is prepared by reaction of the diamine compounds (B) and the acid anhydride (C); the diamine compounds (B) contains the polyethylene oxide alkenyl diamine (a) and the carboxyl diamine (b), and is used for obtaining the anhydride (C) of the imide compound (A), wherein the anhydride (C) contains cyclohexane-1,2,4-tricarboxylic acid-1, 2 -anhydride (e); the polyamide imide resin contains carboxyl; and the solid acid value is greater than 30 mgkoh / g.

Description

technical field [0001] The invention relates to a polyamide-imide resin and a method for producing the polyamide-imide resin. Background technique [0002] In various fields centering on the electrical and electronic industry, resin materials that are translucent and have excellent solubility in alkaline solutions are used in insulating materials, adhesives, resins for film raw materials, and the like. [0003] Conventionally, epoxy acrylates and urethane acrylates having carboxyl groups have been used as alkali-soluble resins, which are known to have solubility in weak alkali solutions, but are inferior to polyamides in terms of other physical properties represented by heat resistance. Imine resin. [0004] Patent Document 1 discloses an alkali-soluble polyimide resin, which has a phenolic hydroxyl group in the resin skeleton, has a Tg of 200° C. or higher, dissolves in a 5% by weight aqueous solution of sodium hydroxide within 10 minutes, and has a thickness of 350 nm. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
Inventor 恩田真司
Owner AIR WATER INC
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