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High-power switch power supply cooling system capable of removing heat by refrigeration agent

A high-power switch and heat dissipation system technology, applied in cooling/ventilation/heating transformation, printed circuit components and other directions, can solve the problems affecting the power density of the switching power supply, the large size of the aluminum radiator, and the damage of the power switch tube. The effect of convenient circuit layout, convenient component layout, and volume reduction

Active Publication Date: 2015-10-14
深圳市龙星辰电源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the power switch in the switching power supply will generate heat during operation. In order to make the switching power supply work reliably and stably, the heat generated by the power switch tube must be dissipated in time, otherwise the power switch tube will be damaged.
Generally, the plastic-encapsulated power switch tube dissipates heat through the aluminum radiator, the plastic-enclosed power switch tube transfers heat to the aluminum radiator, and the aluminum radiator dissipates the heat to the surrounding space through air cooling or natural cooling. There must be enough effective heat dissipation area to dissipate the heat generated by the plastic-encapsulated power switch tube. Therefore, the conventional aluminum heat sink has the disadvantages of large volume, large space occupation and heavy weight, which affects the power density of the switching power supply. make miniaturization limited

Method used

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  • High-power switch power supply cooling system capable of removing heat by refrigeration agent
  • High-power switch power supply cooling system capable of removing heat by refrigeration agent

Examples

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Embodiment 1

[0013] Example 1 figure 1 In the shown embodiment, a high-power switching power supply heat dissipation system using refrigerant to transfer heat in this embodiment is mainly composed of an internal radiator, an external condenser, a compressor and an insulating tube. The external condenser is Finned coil structure, the upper end of the coil of the external condenser has a return air input interface, and the lower end of the coil of the external condenser has a refrigerant output interface. There is a plane for installing the power switch tube on the front of the heat transfer radiator 1, and there is a pressing screw hole for fastening the power switch tube on the front plane of the heat transfer radiator 1, and there is a lower part of the front of the heat transfer radiator 1 to avoid The pitch notches of the power switch tube pins, the lower end of the heat transfer radiator 1 is a closed entity, and there are mounting screw holes 1-2 in the closed entity at the lower en...

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PUM

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Abstract

The invention discloses a high-power switch power supply cooling system capable of removing heat by a refrigeration agent and relates to a cooling device. The high-power switch power supply cooling system consists of a built-in radiator, a machine-out condenser, a compressor and an insulation tube, wherein the built-in radiator is of heat removing type, and is internally provided with an evaporation chamber, an input joint is arranged at the back side of the lower part of the evaporation chamber, and an output joint is arranged at the upper part of the evaporation chamber; a compression reed is arranged on the heat removing type radiator and consists of a compression surface, an elastic bend and compression legs; the insulation tube comprises an air returning pipe and a connecting pipe, the output joint of the heat removing type radiator is connected to an air returning input joint of the machine-out condenser through the air returning pipe, the compressor and an air discharging pipe, a refrigeration agent output joint of the machine-out condenser is connected to an input joint at the lower part of the heat removing type radiator through the connecting pipe and a throttling capillary tube. According to the high-power switch power supply cooling system, the heat generated by a power switch pipe is rapidly dispersed by adopting a heat removing mode of absorbing heat by the refrigeration agent; the size of the radiator is greatly reduced, so that the occupying space of the radiator is saved, the switch power structure is compact, the power density is high, and the miniaturization is realized.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a plastic-encapsulated power tube. Background technique [0002] At present, switching power supplies are widely used in industrial production, municipal solid waste disposal, communication, electric power and other fields. The general requirements for switching power supplies are reliability, stability, small size and high efficiency. High efficiency and miniaturization. However, the power switch in the switching power supply generates heat during operation. In order to make the switching power supply work reliably and stably, the heat generated by the power switch tube must be dissipated in time, otherwise the power switch tube will be damaged. Generally, the plastic-encapsulated power switch tube dissipates heat through the aluminum radiator, the plastic-enclosed power switch tube transfers heat to the aluminum radiator, and the aluminum radiator dis...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K1/02
Inventor 周开根
Owner 深圳市龙星辰电源有限公司