High-power switch power supply cooling system capable of removing heat by refrigeration agent
A high-power switch and heat dissipation system technology, applied in cooling/ventilation/heating transformation, printed circuit components and other directions, can solve the problems affecting the power density of the switching power supply, the large size of the aluminum radiator, and the damage of the power switch tube. The effect of convenient circuit layout, convenient component layout, and volume reduction
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0013] Example 1 figure 1 In the shown embodiment, a high-power switching power supply heat dissipation system using refrigerant to transfer heat in this embodiment is mainly composed of an internal radiator, an external condenser, a compressor and an insulating tube. The external condenser is Finned coil structure, the upper end of the coil of the external condenser has a return air input interface, and the lower end of the coil of the external condenser has a refrigerant output interface. There is a plane for installing the power switch tube on the front of the heat transfer radiator 1, and there is a pressing screw hole for fastening the power switch tube on the front plane of the heat transfer radiator 1, and there is a lower part of the front of the heat transfer radiator 1 to avoid The pitch notches of the power switch tube pins, the lower end of the heat transfer radiator 1 is a closed entity, and there are mounting screw holes 1-2 in the closed entity at the lower en...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 