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Loss Estimation Method for Modular Multilevel Converter

A modular multi-level, converter technology, used in instrumentation, computing, electrical digital data processing, etc.

Active Publication Date: 2019-01-11
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the large number of semiconductor devices contained in MMC, it is necessary to select a reasonable type according to its characteristics such as loss and temperature rise during operation. However, searching the existing literature, there is no loss estimation method for MMC topology converters.

Method used

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  • Loss Estimation Method for Modular Multilevel Converter
  • Loss Estimation Method for Modular Multilevel Converter
  • Loss Estimation Method for Modular Multilevel Converter

Examples

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Embodiment

[0068] This embodiment proposes a method for estimating the loss of a modular multilevel converter, which includes the following steps: determine the current coefficient according to the characteristics of the selected semiconductor device, and determine the on-state characteristic curve of the transistor, the volt-ampere characteristic curve of the diode, and the switching characteristic of the transistor curve and diode reverse recovery characteristic curve for interpolation fitting; when the modular multilevel converter is in steady state operation, judge the trigger signal of each component of the sub-module and the direction of the current flowing through the sub-module, and calculate the corresponding Transistor operating loss power, turn-on loss power and turn-off loss power, and diode operating loss power and reverse recovery loss power.

[0069] Specifically, the method for estimating the loss of a modular multilevel converter in this embodiment includes the following ...

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Abstract

The invention discloses a modular multilevel converter (MMC) loss estimation method which comprises the following steps of: determining a current coefficient according to characteristics of a selected semiconductor device, and performing interpolation fitting on an on-state characteristic curve of a transistor, a volt-ampere characteristic curve of a diode, a switching characteristic curve of the transistor and a reverse recovery characteristic curve of the diode; and when an MMC is in steady-state operation, judging a trigger signal of each device of sub-modules and a current direction flowing through the sub-modules, and calculating operating loss power, turn-on loss power and turn-off loss power of the transistor and operating loss power and reverse recovery loss power of the diode for each device. The method adopts the characteristic curve of the semiconductor device, subjected to fitting of a polynomial such as g(j)=a+b*jc, and has the characteristic of small calculated amount and high precision; and the overall MMC loss can be calculated more accurately and the distribution situation of the modular MMC loss at all parts of the device can be effectively evaluated.

Description

technical field [0001] The invention relates to a method for calculating loss, in particular to a method for estimating loss of a modular multilevel converter. Background technique [0002] Modular Multilevel Converter (MMC) adopts the cascade structure of modular design sub-modules, which has flexible and scalable characteristics. Compared with the traditional two-level voltage source converter, it has The advantages of good output characteristics, low harmonic content, no need for AC filters, and more suitable for occasions with high voltage levels are more and more used in VSC-HVDC systems. Due to the large number of semiconductor devices contained in MMC, it is necessary to select a reasonable type according to its characteristics such as loss and temperature rise during operation. However, searching the existing literature, there is no loss estimation method for MMC topology converters. Contents of the invention [0003] The purpose of the present invention is to pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 林环城王志新
Owner SHANGHAI JIAO TONG UNIV
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