A kind of coating method and mask jig
A mask fixture and mask technology, which is applied in sputtering plating, ion implantation plating, vacuum evaporation plating, etc., can solve the problem of incapable of one-time coating of quartz pendulum plate, incapable of coating on the side wall of the hollowed out part, and incapable of simultaneous coating And other issues
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Embodiment 1
[0057] An embodiment of the present invention provides a coating method. The mask fixture with the target object is fixed on the sample holder, and the target object is coated by magnetron sputtering. During the coating process, the sample holder is flipped along its rotation axis, wherein, The size of the side hollow area of the mask is greater than the design size of the corresponding side coating area of the quartz pendulum; and the angle between the rotation axis of the sample holder and the side coating area of the quartz pendulum should be less than 90°, and the above angle should be less than 90° The meaning of ° means that when the side coating area is a plane, the angle between the rotation axis of the sample holder and the plane where the side coating area is located is less than 90°; when the side coating area is a curved surface, the rotation axis of the sample holder and the plane The included angles of all cut surfaces in the side coating area are less than ...
Embodiment 2
[0063] The difference between embodiment 2 and embodiment 1 is that an elastic member 15 is provided between the upper mask sheet 10, the lower mask sheet 12 and the flexible beam 3, and the elastic member 15 fills the gap between the flexible beam 3 and the outer ring 1. The gap formed between the flexible beam 3 and the upper mask sheet 10 and the lower mask sheet 12 due to the thickness difference between the pendulum 4 and the mass pendulum 4 . In this embodiment, the angles between the rotation axis and the side coating area one 5, the side coating area two 6, the side coating area three 7 and the side coating area four 8 are respectively 35°, 55°, 80° and 80°; The power used for the coating is 150w, and the plating time is 50s. The power used for plating the Au film is 250w, and the plating time is controlled at 1500s. The specific implementation data are shown in Table 1, and the measurement results are shown in Table 3.
Embodiment 3
[0065] The difference between embodiment 3 and embodiment 2 is that the power used when plating the Cr film is 200w, and the plating time is 80s; the power used when plating the Au film is 300w, and the plating time is controlled at 1800s; The oscillating angle and frequency of the source are different, and the rotation rate of the sample holder is different; in this embodiment, the angles between the rotation axis and the side coating area one 5, the side coating area two 6, the side coating area three 7 and the side coating area four 8 are respectively 25 °, 65°, 20° and 20°; see Table 1 for specific implementation data and Table 3 for measurement results.
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