Novel planar Magic-T based on folded substrate integrated waveguide

A substrate-integrated waveguide and folding technology, which is applied in the microwave field, can solve the problems of small relative bandwidth, large size of three-dimensional magic T structure, and difficulty in integration, and achieve the effect of reduced size, small size, and simple design process

Active Publication Date: 2015-11-04
NANJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

The three-dimensional magic T structure based on the traditional rectangular waveguide has a large size and is not easy to integrate. Since the microwave circuit tends to be planar, it has been extended to the planar circuit by many scholars.
However, due to the narrow bandwidth limitation of the transition from the slot line to the substrate integrated waveguide, the relative bandwidth of the magic T is small

Method used

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  • Novel planar Magic-T based on folded substrate integrated waveguide
  • Novel planar Magic-T based on folded substrate integrated waveguide
  • Novel planar Magic-T based on folded substrate integrated waveguide

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Embodiment Construction

[0027] Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:

[0028] The present invention provides a novel planar magic T based on folded substrate integrated waveguide, such as Figures 1 to 4 As shown, it includes the upper and lower dielectric substrates, the top metal layer, the middle metal layer, the bottom metal layer, and the first to sixth metal via columns. The top metal layer is located on the upper surface of the upper dielectric substrate, and the middle metal layer is located on the upper and lower layers. Between the dielectric substrates, the underlying metal layer is located on the lower surface of the lower dielectric substrate.

[0029] The first and second metal via rows are parallel to each other and form an FSIW with the top metal layer, middle metal layer, and bottom metal layer, wherein the first metal via row connects the top metal layer, middle metal layer, and bottom metal layer, a...

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Abstract

The invention discloses a novel planar Magic-T based on a folded substrate integrated waveguide. The folded substrate integrated waveguide is used to realize an H-surface power divider, a T-shaped junction of a conventional trough line excitation substrate integrated waveguide, and the planar Magic-T is realized. The leakage loss is less, the power capacity is higher, and the bandwidth is larger. By means of the open-circuit and short-circuit characteristics of the folded substrate integrated waveguide and the conventional substrate integrated waveguide, a relatively high isolation degree between two input ports is realized, and the unbalance degrees of amplitudes and phases between two output ports are very small, so that the performance of the Magic-T is improved, the design process is simplified, and the Magic-T is easy to apply to a higher frequency band. The overlapping of T-shaped junction of an H-surface and an E surface enables a high integration level of the structure, and the requirements of planarization, miniaturization and high performance in modern radio communication are met.

Description

technical field [0001] The invention relates to a novel planar magic T based on folded substrate integrated waveguide, which belongs to the field of microwave technology. Background technique [0002] Since the folded substrate integrated waveguide was proposed, it has aroused the interest of many researchers. It has been used in microwave filters and antennas by integrating with planar circuits, reducing the size of the circuits. The three-dimensional magic T structure based on the traditional rectangular waveguide has a large size and is not easy to integrate. Since the microwave circuit tends to be planar, it has been extended to the planar circuit by many scholars. However, the relative bandwidth of the magic T is small due to the narrow-band limitation of the transition from the slot line to the substrate-integrated waveguide. This has prompted the design of transitions for wider frequency bands. Designing the transition from broadband microstrip line to folded subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/20
Inventor 许锋许娇娇
Owner NANJING UNIV OF POSTS & TELECOMM
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