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Ag-CuO low-voltage contact material and preparation method thereof

A kind of contact material, ag-cuo technology, applied in the direction of contacts, electrical components, electric switches, etc., can solve the problem that the development and performance requirements of low-voltage electrical appliances cannot be met, the contact resistance and temperature rise of contact materials increase, and arc erosion resistance Insufficient capacity and other problems, to achieve the effect of excellent hardness and sintering activity, low resistance to fusion welding, excellent resistance to mechanical wear and arc erosion

Inactive Publication Date: 2015-11-11
QINGHAI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Commonly used low-voltage contact materials are: Ag-CdO, Ag-SnO 2 , Ag-Ni, etc., but these traditional materials can no longer meet the development and performance requirements of low-voltage electrical appliances
Ag-CdO contact materials release toxic Cd vapor during use; Ag-SnO 2 Contact material due to liquid Ag and SnO 2 The wettability of the particles is poor. During the use of low-voltage electrical appliances, the contact resistance and temperature rise of the contact material increase, and the service life of the material decreases; the Ag-Ni contact material has insufficient arc erosion resistance and other problems.

Method used

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Examples

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preparation example Construction

[0014] The method for preparing the Ag-CuO low-voltage contact material as described above includes steps: S1, preparing and obtaining the CuO skeleton through a high-temperature sintering process; S2, heating and melting the metallic silver material; S3, melting the molten The metal silver material is filled into the CuO skeleton to obtain the Ag-CuO low-voltage contact material.

[0015] In the Ag-CuO low-voltage contact material provided above, the CuO skeleton of the ceramic phase is prepared by a high-temperature sintering process, and metal silver is added to the CuO skeleton structure to make a composite contact material. There is good wetting between CuO and liquid silver. Wet performance can combine the high strength of the skeleton reinforced material with the high electrical and thermal conductivity of the metal material to obtain a skeleton reinforced composite material with excellent comprehensive performance. The CuO skeleton of the ceramic phase has strong arc e...

Embodiment 1

[0022] This embodiment provides an Ag-CuO low-voltage contact material, which includes a CuO skeleton and metallic silver material filled in the CuO skeleton. Specifically, firstly, a CuO skeleton is prepared through a high-temperature sintering process; then, the metallic silver material is heated and melted, and the molten metallic silver material is filled into the CuO skeleton to obtain the Ag-CuO low-voltage contact material. Wherein, what is prepared by high-temperature sintering process is the CuO skeleton of ceramic phase, which contains pores with a diameter of 1-10 μm.

[0023] In this embodiment, the volume of the CuO skeleton accounts for 80% of the total volume of the low-voltage contact material, and the metallic silver material accounts for 20% of the total volume of the low-voltage contact material. Further, in order to improve the interfacial bonding between the metallic silver material and the CuO skeleton, and improve the interfacial wettability of the mater...

Embodiment 2

[0027] This embodiment provides an Ag-CuO low-voltage contact material, which includes a CuO skeleton and metallic silver material filled in the CuO skeleton. Specifically, firstly, a CuO skeleton is prepared through a high-temperature sintering process; then, the metallic silver material is heated and melted, and the molten metallic silver material is filled into the CuO skeleton to obtain the Ag-CuO low-voltage contact material. Wherein, what is prepared by high-temperature sintering process is the CuO skeleton of ceramic phase, which contains pores with a diameter of 1-10 μm.

[0028] In this embodiment, the volume of the CuO skeleton accounts for 40% of the total volume of the low-voltage contact material, and the metallic silver material accounts for 60% of the total volume of the low-voltage contact material. Further, in order to improve the interfacial bonding between the metallic silver material and the CuO skeleton, and improve the interfacial wettability of the mater...

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Abstract

The invention discloses an Ag-CuO low-voltage contact material which comprises a porous CuO skeleton and a metallic silver material filled in the CuO skeleton, wherein the volume of the CuO skeleton accounts for 40-80% of the total volume of the low-voltage contact material and the rest is the metallic silver material. The invention also discloses a preparation method of the above Ag-CuO low-voltage contact material. According to the above Ag-CuO low-voltage contact material, the ceramic-phase CuO skeleton is prepared by a high-temperature sintering process, and metallic silver is added into the CuO skeleton structure so as to prepare the composite contact material. CuO and liquid silver have good wettability, and high strength of the skeleton reinforced material and high conductivity and thermal conductivity of the metallic material can be combined, so as to obtain the skeleton reinforced composite material with excellent comprehensive performance.

Description

technical field [0001] The invention relates to the technical field of contact materials, in particular to an Ag-CuO low-voltage contact material and a preparation method thereof. Background technique [0002] Contact material is a widely used basic electrical component, responsible for the task of connecting and disconnecting the load circuit current, its quality determines the breaking ability of low-voltage electrical components and the reliability of the electrical contact circuit. At present, silver-oxide contact materials are widely used in low-voltage electrical appliances. Commonly used low-voltage contact materials are: Ag-CdO, Ag-SnO 2 , Ag-Ni, etc., but these traditional materials can no longer meet the development and performance requirements of low-voltage electrical appliances. Ag-CdO contact materials release toxic Cd vapor during use; Ag-SnO 2 Contact material due to liquid Ag and SnO 2 The wettability of the particles is poor. During the use of low-volta...

Claims

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Application Information

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IPC IPC(8): H01H1/0237
CPCH01H1/0237
Inventor 铁生年王军高梦宇杨啟明
Owner QINGHAI UNIVERSITY
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